PCB英文词汇.xlsVIP

Sheet3 Sheet2 Sheet1 阻挡紫外线 Voltage I 培 训 教 材 编号: PCB(Printed Circuit Board) MI(Manufacturing Instruction) PTH(Plating Through Hole) A.O.I(Automatic Optical Inspection) E-Test(Electrical Test) Project No. Customer Customer P/N Model No. Mech Drawing No. Section Code Change Department Originator QA(Quanlity Assurance) Effective date Product Planning Dept. Section Code Moulding ECN(Engineering Change Notification) 文件种类 模房 货仓 数量 组别代号 有效期 品质部 组别代号更改 产品名称 电测试 Drilling Unit Arrangement Profiling Process Film Fabrication Dry Film Plating Etching S/M(Solder Mask) Test Packing Artwork Drawing Lay-up Instruction Hole V-Cut Length Width No. of holes Panel Area Panel Utilization Supplier Sheet Size Copper area Material Thickness Laminate Thickness 材料厚度 铜面积 大料尺寸 宽度 包装 测试 元件字符 蚀刻 电镀 干菲林 钻孔 单元排版 工序流程 一般资料 Board Thickness Multi-layer Laminate After Pressed Thickness Panel Size No.of Panel/Sheet No.of Array/Panel No.of Unit/Array Raw Material Utilization Max. X-out Panel Size After Outerlayer Cutting Dry Film-Pattern Cu/Sn Plating Wet Film HAL(Hot Air Leveling) Final QC QA Audit Unit Layout Per Panel View From… Top side Solder side Bottom side 镀铜锡 开料 外层切板后拼板尺寸 坏板上限 原材料利用率 每套单元数 每个拼板套板数 每张大料拼板数 拼板尺寸 压板后之厚度 双面板 板厚 Hole size Corner REG.Hole Target Hole Test Pattern D/F Registration Hole W/F(Wet Film) D/F(Dry Film) Tape Programming Artwork Film Solder Side Circuit Customer Drilling File Hole Location Chart Hole Position Tolerance No.of Panel per Stack Profiling Method Punch Hand Rout 铬带制作 干膜 湿膜 干菲林对位孔 测试孔 角位对位孔 目标孔 间距 焊盘 钻咀 孔尺寸 Bevelling Artwork No. Image Solder Side Cir. Solder Side S/M Solder Side C/M Peelable Mask Description Etch Logo Date Code Location Criteria Line Width Min.Spacing between Line to Line Min.Spacing between Line to Pad Min.Spacing between Pad to Pad Legend Width Artwork Modification 丝印 说明 标记 可脱油 碳油 阻焊面字符 焊接面阻焊 项目 斜边 特殊要求 Min Hole Wall Copper Thickness Min Conductor Copper Thickness Max.Board Thickness After Plating Min. Tin-Lead Thickness (After HAL)