半导体专业词汇--汇总.xlsVIP

Sheet3 Sheet2 Sheet1 rebonding bonding pad/area handler of stack magazine blade breakage detector (B.B.D) non-contact setup (N.C.S.) down set aluminum layer first grinding wheel chuck table waiting for inspection shut down cross reference ball short ball height probe mark 压痕深浅 剪切性压痕 第二点脱落 开窗 真空吸笔 片盒 中大功率生产部门 共晶装片 封装形式 AUTO模 去湿保护 热加压 烘烤去湿 超期待烘产品烘烤及生产纪录 紫铜工具 零头批 补零 混管 工位 稳流 稳压 电源 键合区温度 工作令 检验托板 圆片平口处 芯片版号（光罩号） 背金/银 破坏性测试 异常报告书 测克异常报告书 测克 钩针 推刀 裸手 capillary mark deep punch mark second bond peel off bond pad opening vacuum tool wafer magazine high power department eutectic die bonding assembly/package type automatic molding system protect for dry heat press/ curing pressure dry dry for overdue prduct of wait for molding and production record copper pin remanence lot remanence fill mix device work station equilibrium current equilibrium voltage power temperature of bonding area examine area mask NO. of wafer flat area backside metal (Au/Ag) destructiveness test abnormal report abnormal report of pull test wire pull hooker shear tools bare fingers 探头 压杆/支撑杆 档块 清膜胶 冲胶机 对角两个点 等离子清洗机 暖机倒计时 除尘布 油面计 进水滤芯 轴流风扇 保证进气通畅，散热可靠 转动件 高压仓焊接处 玻璃胶 挡片 回油过滤器 高压过滤器 检查液压部分泄露情况 热滚压膜机 冲歪率 明火 试膜 防粘膜 塑封材料报废记录表 gage head contact knighthead stopper derunner machine sample two point across the wafer center plasma clean machine warm up reverse timing dust cloth the meter of iol face input wafer filter axial fan guarantee air inlet open, reliable heat rotating pieces the high-pressure welding positions glass (epoxy for glass) block tablets (stopper) return filters high pressure filters check leaking hydaraulic oil: construed as part of the hydaraulic leak wafer mounter for epoxy film type wire sweep rate fire molding of try run to avoid mold sticking the molding compound wastes resord 脚受损 loose lead 脚弯 lead skew 脚沾污 接地静电环 接地手环 接地线 揭膜 金球大小 gold wire 金线 金属剥落 金属层架桥 金属承载盘 金属划伤 进刀方向 进胶口 进料检验 禁止在工作场所吃东西 Eating and drinking are not allowed at work area. 晶片粘着于框架内脚 晶体背面受损 晶体的任何一边少于75%的长度看不见溢出焊晶材料 晶体上不得有任何龟裂 晶体