波峰焊PFMEA.xlsVIP

Dacor Switches Drawing Number Pre-Launch Date D FAILURE MODE AND EFFECTS ANALYSIS FMEA Number: Prepared by: Date (Orig.) Team: C Potential O Potential S l Cause(s)/ c Current e R. Recommended Responsibility Action Results Failure Effect(s) of a Mechanism(s) t P. Actions Target Actions Mode Failure v s of Failure u Controls N. Taken r Part Name Process Responsibility: Process Number Production Prototype PROCESS FMEA 01 Rev. PCB Baking Warpage Delamination Cosmetic defects Escapee to customer Wrong temperature and duration setting None None Inspection escapee Production Operator Functional failure Manual Insertion Wrong Part Testing failure Escapee to customer Wrong part received from prepping of taken from storage location missing part Functional failure 100% Pre Wave Inspection Pre Wave Inspection escapee Boards not properly segregated Production Operator poor soldering No/Insufficient solder incorrect Flux dirty Daily flux tunk cleaning Chip and main wave height low verify solder contact area with glass board:weekly solder bridging Solder pot temperature low PCB delamination Temperature setting high solder wave contact time high Due to board vibrate when go into wave soldering PCB damage Part damage Cosmetic defect Escapee Workmanship error inspection Testing Packaging Improper handing location Use wrong working instruction Wrong part inserted to the workmanship error Cosmetic reject WI indicates inspection item Excessive flux residue PCB blistering PCB warp slanting Past Wave Functional Test Final Inspection QA not following the packaging Pre wave Equipment Engineer PCBA fixed with housing check for solder height/ change of model coverage every shift or Visual inspection Cosmetic defect instruction Damage part Quantity incorrect Equipment Engineer Equipment Engineer Poor cosmetic. Visual failure. Visual inspection. IQC Operator. Wrong value; Wrong part; Wrong size. Functional failure. Assembly failure. Wrong part / wrong value or wrong size rece