波峰焊接质量记录表.xlsVIP

Wave Solder Daily Defect Distri ICT FCT Daily Review Sum IPQC Wave solderDaily Review Summary IPQC Daily Sampling Summary Cover A AT01 AT300000 AD DataDaily df fh fqa fqadd G IQC IV400000 M MD640 PrintDate ReportTitle S1In S2In S3In S4In S5In S6In Stage1 Stage2 Stage3 Stage4 Stage5 Stage6 SunDay TableBottom WeekNum1 WeekNum2 WeekNum3 WK36 Y YYY Z Wave Soldering Daily Defect Distribution 波峰焊每日不良分布(June7,07) M/C No. Shift Total points Defect points Total PCB Qty Opportunity Points PPM Cold Solder Short Component float Missing Solder Missing Component Others 炉号 班次 总点数 坏点数 总板数 机会点数 PPM 假焊 短路 浮高 空焊 漏料 其它 9.00 57120.00 85.00 24.00 2380.00 1488.10 1000000.00 16.00 24.00 21.00 10.00 11.00 3.00 10.00 11.00 Total合计 57120.00 85.00 24.00 2380.00 1488.10 16.00 24.00 21.00 10.00 11.00 3.00 Remark:/备注 cold solder 假焊 short 短路 component float 浮高 missing solder 空焊 missing component 漏元件 others 其它 不良点数 9W/S Defect Item Distribution 10W/S Defect Item Distribution 11W/S Defect Item Distribution Back to Cover ICT/FCT Daily Review Summary ICT/FCT 每日测试总结 Production outgoing status 生产出货状况 Date Jun 4 Jun 5 Jun 6 Jun 7 Jun 8 Jun 9 Jun 10 Jun 11 Jun 12 Jun 13 Jun 14 Jun 15 Jun 16 日期 ICT process points 238200.00 238200.00 11900.00 166600.00 ICT测试点 ICT process defective points 1.00 17.00 3.00 35.00 ICT 测试不良点 DPM 4.20 1000000.00 71.37 1000000.00 252.10 1000000.00 210.08 1000000.00 不良率 DPM Target 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 不良率目标 FCT process Qty 100.00 100.00 500.00 700.00 功能测试数量 FCT process defective Qty 1.00 2.00 9.00 7.00 功能测试不良数量 Defect rate % .01 .02 .02 .01 不良率 Defect Rate % Target .01 .01 .01 .01 .01 .01 .01 .01 .01 .01 .01 .01 .01 不良率目标 ICT Daily Defect Distribution (Top 6 Defects) ICT 每日测试不良分布(前6项) No. Inspection Points Defect. Points Distribution of Top 6 Defects PPM Reason Analysis Corrective Action 项目 测试点数 不良点数 前6项不良分布 不良率 原因分析 纠正措施 1.00 47600.00 13.00 Component Failed 273.11 1000000.00 Component Faile