大功率LED封装散热研究(供参考).doc

摘 要 发光二极管（LED）以其节能、环保、全固态、长寿命等特点受到关注，尤其是大功率LED在固态照明领域里的使人们对其取代传统光源希望与日俱增。 本文功率LED的封装技术改善大功率LED散热性能提高封装可靠性。： ①LED芯片制备和封装工艺过程影响LED可靠性，针对提出了可行的优化设计方案。②分析了结温与LED光电参数之间的关系。采用热阻模型，③提出了一种大功率高亮度LED的封装技术通过对采用该封装技术的1W级功率型LED的实验测试，验证了该技术能有效的大功率LED封装的散热可靠性。 关键词：大功率LED，封装，可靠性，结温，热阻，散热性能 Abstract Light emitting diode (LED) has caused more and more attention because of its superior characteristics such as energy-saving, environmental protection, solid-state and long-time using. When the high power and high brightness LED was used wildly in the filed of Solid State Lighting, people believed that it can replace the traditional lighting source in the near future. But now, there are still many factors which restricting the development of LED, one of the most important reasons, which generally exist, is the poor process of heat-release and the low reliability of LED packaging. In this paper, we design a kind of technology about heat-release package of high-power LED. Through our experimental analysis, the performance of reliability and thermal management of high-power LED is improved at the final testing. The main contains were divided into three parts: ① Through introducing the chip manufacturing and packaging process, we analyzed the wire boning、chip adhering and ESD process. Then, we give some better designing on each step. ② Analyzed the relationship between junction temperature and optical-electric parameter of LED. After analyzed the thermal resistance model, we concluded that using the material which has low thermal conductive can do well in heat-release process of LED packaging. ③ Design a kind of packaging technology about high-power and brightness LED. Choosing sapphire-based LED flip-chip, making nine convex metal points bonding which extend the area between metal-ball and PCB, using the In as solder and heat sink material to decrease the thermal resistance and matching ratio of thermal expansion. Using silicon glue and yellow phosphor, and filling the mixture on the posit