半导体硅材料研磨液研究进展.pdfVIP

2009 年 第 8 期 广 东 化 工 第 36 卷 总第 196期 · 87 · 半导体硅材料研磨液研究进展 杨杰 1 1 2 1 ，曾旭 ，李树岗 ，贺岩峰 (1 ．长春工业大学，吉林 长春 130012 ；2 ．上海新阳半导体材料有限公司，上海 201616) [摘 要]随着 IC 制造技术的飞速发展，为了增加 IC 芯片产量和降低单元制造成本，硅片逐渐趋于大直径化，然而为了满足 IC 封装的要求， 芯片的厚度却在不断的减小。因此，对硅片加工的表面质量提出了更高的要求。文章详细说明了硅片研磨机理及工艺条件；重点阐述了在半导 体硅片的研磨过程中研磨液的组成及各个组分的作用；并介绍了国内外研磨液的发展现状，指出了其优缺点；最后强调了研磨液开发的重要性。 [关键词]研磨液；研磨；硅片；悬浮 [中图分类号]TQ [文献标识码]A [文章编号]1007-1865(2009)08-0087-03 Research Progress on the Lapping Slurry of Semiconductor Si-materials 1 1 2 1 Yang Jie , Zeng Xu , Li Shugang , He Yanfeng (1. Changchun University of Technology, Changchun 130012 ；2. Shanghai Sinyang Semiconductor Materials Co., Ltd., Shanghai 201616, China) Abstract: With the rapid development of IC manufacturing technology, in order to increase the yields of chips and reduce unit manufacturing cost ，the diameter of wafer trends to be larger, but in order to meet the requirements of IC package, the thickness of chip is constantly decreasing. Thus, the higher requirement of silicon surface quality has been put forward. In the paper, the detailed description of mechanism and process conditions were given ；the composition of lapping slurry and the role of the various components were focused on ；and the development of lapping slurry was reviewed at home and abroad ，and the advantages and disadvantages were pointed out ；Finally the importance of the development of slurry was emphasized. Keywords: lapping slurry ；lapping ；silicon wafer ；suspension 目前集成电路(IC)技术已经得到了迅