工艺参数对陶瓷激光热应力切割质量的影响.pdfVIP

45 1 上 海 交 通 大 学 学 报 Vol. 45 No. 1 2011 1 JOU RNAL OF SH ANGH AI JIAOT ONG UNIVERSITY Jan. 2011 : 1006-2467( 2011) 01-0040-05+ 004 胡 俊, 曹倩倩, 罗敬文 ( , 200240) : 建立了激光热应力切割有限元仿真模型, 于研究三维对称氧化铝陶瓷基片切割过程中 的温度场和热应力场分布, 以及激光功率陶瓷厚度和切割速度等工艺参数对材料表面最高温度和 应力的影响, 并通过对比实验验证了该模型的正确性. 结果表明, 随着裂纹尖端的临界正应力增加, 断裂表面的微裂纹加深, 并引起材料表面的颗粒剥落, 使得切割断面的粗糙度增大. : 陶瓷; 激光加工; 热应力切割; 可控断裂; 温度场 : TG 485 : A Effect of Technological Parameters on Lase-r Cont rolled Thermal Stress Cutt ing Quality of Ceramics H U J un, CA O Qi an-qi an , L UO J i ng-w en ( School of M echanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China) Abstract: In order to study the distributions of temperature field and thermal stress field, a three-dimen- sional axial symmetric model of alumina ceramic was established. This paper described the thermal stress. s variation of the cutting point and studied the influence of laser pow er, ceramic thickness and cutting speed on the temperature field and thermal stress field. T he model w as validated by comparative exper-i ments. T he results show that w ith the increase of the tensile stress, the microcrack becomes deeper, w hich induces more surface particles to run off, then the roughness increases. Key words: ceramic; laser-controlled; thermal stress cutting; controlled fracture; temperature field [ 4-5] ; Quintero CO2 YAG , . , [ 6] , ; T sai , , [ 1]