通孔回流焊过程中锡膏收缩因子的晶体学建模.pdfVIP

电子工艺技术电子工艺技术 年 月 第 卷第 期 Electronics Process TechnologyElectronics Process Technology 2121 年 月 第 卷第 期 36 1 11 36 1 通孔回流焊过程中锡膏收缩因子的晶体学建模 张艳鹏，孙守红，王玉龙 （中国科学院长春光学精密机械与物理研究所，吉林 长春 130033） 摘　要：按简单立方晶格对金属质量分数为90%的锡膏内焊粉分布进行了建模，建模后锡膏在通孔回流焊 过程中的收缩因子为52.36%。所建模型能够有效指导锡膏生产过程中焊粉与添加剂的配比，且焊粉堆积形成的 较大空隙能为锡膏受热生成的气体提供逸散通道，形成气泡率低的焊点结构。按简单立方晶格模拟焊粉分布能 够提高表贴细密引脚间距器件丝网印刷的分辨率，能够促进通孔插装器件与表贴元器件装联制程的统一。 关键词：通孔回流焊；晶体学建模；锡膏收缩因子 中图分类号：TN604　文献标识码： Ａ　文章编号：1001-3474（2015）01-0021-04 Crystal Modelling Method for Shrinking Factor of Solder Paste During Pin-in-Paste Solder Process ZHANG Yan-peng, SUN Shou-hong, WANG Yu-long ( Changchun Institute of Optics, Fine Mechanical and Physics, Chinese Academy of Sciences, Changchun 130033, China ) Abstract: Simple cubic lattice modelling for the solder powder in the solder pastes, which have about 90wt% metal content. The shrinking factor calculated using the modelling is 52.36% during the Pin-In- Paste solder process. Proportion between the solder powder and the additive can be determined when the solder pastes are manufactured. Moreover, the larger spacing among the solder powders can provided as the leaking passageway for the gas generated when the solder pastes are heated, so that low bubble rate solder forms. The modelling solid powder’s distribution not only can improve the resolution of the printing for the fine pitch components, but also can promoting the assembling process of through hole and SMT components. Key Words: Pin-In-Paste solder process; Crystal modelling; Shrinking factor of solder paste Document Code: A Article ID: 1001-3474(2015)01-0021-04 电子组装行业在过去的几十年中主要经历了 （through hole printing reflow），是一种运用表面 以下三个过程：（1）通孔插装器件的手工焊接；