外文翻译--模流仿真在电子封装中的应用原版.pdf

The Application of Mold Flow Simulation in Electronic Package Kevin Chai, Vicky Liu, Y. P. Wang and T. D. Her Siliconware Precision Industries Co., Ltd. No. 123,Sec. 3, Da-Fong Rd., Tantzu, Taichung, Taiwan 427, R.O.C. Abstract basic input items for C-MOLD simulation includes three The application of CAE in mold flow of IC packaging parts. First, we create the geometry model of molding has been developed for years. However, to predict the flow cavities which mold compound will be introduced to. The behavior of EMC accurately in IC packages during cavity might be divided to two or three modeling sub- transfer molding is still a huge challenge due to its cavities for leadframe or heat spreader attached design. instrinsic limitations. In this paper, the modeling Second, the mold compound type with its physical flow technologies to analyze the mold flow during properties is choosed for the flow characterization semiconductor encapsulation have been developed. The simulation. The process condition, such as melt