各向异性导电胶倒装封装电子标签的可靠性.pdf

电子工艺技术 年 月 2010 9 Electronics Process Technology 249 综述 · · 各向异性导电胶倒装封装电子标签的可靠性 2 1,2 1,2 1,2 陶军磊 ，安兵 ，蔡雄辉 ，吴懿平 （1．武汉光电国家实验室，湖北 武汉 430074 2．华中科技大学连接与电子封装中心，湖北 武汉 430074） 摘 要 ：各向异性导电胶（ACA）广泛用于RFID 电子标签芯片封装，具有芯片对位方便、热压温度低和 工艺时间短的优点。但ACA 互连本质上是机械接触，其互连可靠性强烈依赖于粘接界面性质、胶水粘接力及环 境稳定性。本文试验表明，168 h高温高湿和D 20 mm心轴弯曲对芯片粘接点的电接触性能有所影响；铜模组良 品率显著高于铝天线Inlay。 关键词 ：电子标签; 各向异性导电胶; 倒装封装; 可靠性 中图分类号 文献标识码 文章编号 ：TN60 ：A ：1001-3474（2010）05-0249-04 Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive 2 1,2 1,2 1,2 TAO Jun-lei , AN Bing , CAI Xiong-hui , WU Yi-ping (1. Wuhan National Laboratory for Optoelectronics, Wuhan 430074, China 2. Huazhong University of Science and Technology, Wuhan 430074, China) Abstract: Anisotropic conductive adhesive (ACA) has been widely used in RFID chip packaging, and bears the advantages of convenient alignment, low processing temperature, and short processing time. Since ACA interconnection is essentially a mechanical contact, its interconnection reliability severely depends on the nature of the bonding interfaces, the adhesive bonding strength and the environmental stability. The experiments showed that, 168 h high temperature and humidity test, and D20 mm mandrel bending test make some impact on the electric contact performance of the bonding point; the yield of the copper module significantly higher than that of the aluminum antenna inlay. Keywords: RFID tag; Anisotropic conductive adhe