IC Process制造流程工艺.pdf

Microtechnology and Microelectronics (626-0001-00L) A. Hierlemann IC Process Flow 1 Chapter 12: ICIC TechnologyTechnology ProcessProcess FlowFlow Andreas Hierlemann ETHETH ZüZüriichh Department BSSE MattenstrasseMattenstrasse 2626 CH-4058 Basel, Switzerland voice: +41 61 387 3150 fax: +41 61 387 3992 andreas.hierlemann@bsse.ethz.ch htthttp:////www.bbell.eththz.chh A. Hierlemann, Bio Engineering Laboratory, D-BSSE Microtechnology and Microelectronics (626-0001-00L) A. Hierlemann IC Process Flow 2 LiteratureLiterature • S.M. Sze, Semiconductor Devices, Physics and Technology, 2nd edition, WileyWiley, • D.J. Roulston, An Introduction to the Physics of Semiconductor Devices, Oxford University Press, 1999 • DD. WidWidmann, HH. MMadder, HH. FFriiedderiichh, TTechhnollogy off IIntegratedd CiCircuiits, Springer 2000. • Campbell, The Science and Engineering of Microelectronic Fabrication, 2nd edition, Oxford University Press, 2001 • M. Madou, Fundamentals of Microfabrication, CRC Press, New York, 2002 • MM. GadGad-elel-HakHak, MEMSMEMS HandbookHandbook, CRCCRC PressPress • O. Brand, Fabrication Technology, in CMOS – MEMS, Baltes, Brand, Fedder, Hierold, Korvink, Tabata (Eds.), Wiley-VCH 2005 • CC. YY. ChangChang, SS. MM. SzeSze, ULSIULSI TechnologyTechnology, McGrawMcGraw-HillHill, • O. D. Trapp et al., Semiconductor Technology Handbook, Technology Associates, 1995 • /reports.html A. Hierlemann, Bio Engineering Laboratory, D-BSSE Microtechnology and Microelectronics (626-0001-00L) A. Hierlemann IC Process Flo