46移动通讯设备结构设计抵抗尘土颗粒侵入的研究.pdf

ANSYS 2011 中国用户大会优秀论文 移动通讯设备结构设计抵抗尘土颗粒侵入的研究 芦娜 许良军 丰皇 北京邮电大学电接触实验室，100876 [ 摘 要 ] 影响移动通讯设备可靠性的因素很多，如：产品结构设计、机电元件的性能和使用环境的变化 （电磁场干扰、温度）等。研究表明电子产品的 14%失效是由沙尘、盐雾引发的。尘土颗粒侵 入电子设备，污染其内部的元件，造成电接触失效，降低接触元件的可靠性。因此，在电子产 品设计时，考虑保护内部元件防止尘土侵蚀，降低尘土对通讯设备的影响是非常重要的。本论 文以手机作为移动通讯设备的代表，研究移动通讯设备结构设计对抵抗尘土侵入并穿透设备内 部区域能力的影响。进行不同结构手机的尘土侵入模拟实验，对风速、尘土浓度、沉降时间等 环境因素对尘土侵入手机的影响进行了分析，并将试验结果与有限元(FEA)分析结果进行比较， 给出了尘土密度在手机内部尘土分布，为移动通讯设备的结构设计及提高可靠性提供指导。 [ 关键词 ] 手机，尘土分布，有限元 A Study on Mobile Communication Device Structure Design Resisting Dust Particles Ingress Na Lu, L.J Xu and Huang Feng, Electric Contact Research Laboratory Beijing University of Posts and Telecommunications, Beijing, 100876, China [ Abstract ] The reliability of mobile communication devices is affected by many factors, such as structure design, mechanical and electrical characteristic of devices, electromagnetic disturbance, electrical contact, dynamic environmental, temperature changes, environmental pollution, etc. Studies show that 14% failure of the electronic products is caused by dust and salt mist. Dust particles ingress electronic device, and contaminate the internal components. This results in electric contact failure and reduced reliability of contact components. It is a very important consideration in electronic product design to protect internal components from operational impairment that due to ingress of dust particles and reduce the impact of dust on the comm