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Effect of surfactant on removal of particle contamination on Si wafers in ULSI.pdf

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Effect of surfactant on removal of particle contamination on Si wafers in ULSI

Available online at SCIENCE @D I R E C T e Transactions of Nonferrous Metals Society of China Science Press Trans. Nonferrous Met. SOC.China 16(2006) s195-sI98 lysxb1 Effect of surfactant on removal of particle contamination on Si wafers in ULSI TAN Bai-mei(@to@), LI Wei-wei(%@%), NIU Xin-huan(T%@$), WANG Sheng-li(E)l%$g), LIU Yu-ling($dZ@) Institute of Microelectronics, Hebei University of Technology, Tianjin 300 130,China Received 10April 2006; accepted 25 Apirl2006 Abstract: The adsorption mechanism of particle on the surface of silicon wafer after polishing or grinding whose surface force field is very strong was discussed, and the removal method of particle was studied. Particle is deposited on the wafer surface by interactions, mainly including the Van der Waals forces and static forces. In order to suppress particles depositing on the wafer surface, it is essential that the wafer surface and the particles should have the same polarity of the zeta pptential. According to colloid chemistry and lots of experiments,this can be achieved by adding surfactants.Nonionic complex surfactant was used as megasonic cleaning solution, and the adsorptive state of particle on