- 1、本文档共58页,可阅读全部内容。
- 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
《《Agilent ICT - Level I》.ppt
Agilent ICT Level - I Content Defect Basic Agilent 3070 Concept Basic Agilent 3070 Concept Agilent 3070 Hardware Structure Cards in Module Support Bay, Vacuum Box, Fixture Fixture/测试夹具 Test Principle/测试原理 Shorts Opens Testing Hardware Analog Test Analog Test Capacitor Test Capacitor Test Inductor Test Diode Zener Test Diode Zener Test TestJet TestJet Setup power sub-program Digital Test Digital Test Boundary Scan HP-UNIX File Structure HP-UNIX File Structure Shell Window BT-BASIC Command BT-BASIC Command Starting a Test Analog Test Debug Board Constant Fixture Constant Pushbutton Debug Conclusion/结论 Thank you 10uA~10mA,default is10mA. Without option ”Sa,re”,”idc” will automatically choose proper ”Sa,re”. DC current idc Used in zener test should be between 0~18V. ASRU range ar To diodo“CO”should be set 1 volt grater than upper limit; to zener should be set greater than alternative source 8.99v so it should be set to 10V. Voltage compliance co Note: 1)diode test can use Guarding to avoid parallel resistance but not zener. 2)??the output of MOA can’t exceed 15VDC. Below is the option configuration between diode and zener: HP TestJet basic principle Solder open is one of the most common problems in current surface mounted printed circuit board, especially to the application of complicated integrated circuit, it is hard to detect the defect by visually inspect, also it is time and energy consuming. HP testjet technology is the patent of HP Inc. It can cover component’s solder open with vector less test. The technology of HP testjet is to measure the small capacitance between component pin and the sensor right above the component. If component pin is not well connected to the circuit board, the measured capacitance will be out of the threshold so that solder open pin can be detected. HP TestJet 测试原理 开焊问题是目前电路板表面贴装生产中最常见的问题之一,特别是对超大规模集 成电路越来越多的使用,靠人眼是很难发现的,而且费时费力。HP TestJet 技术是惠普公司的专利,它提供了一个用于元件引脚开路时的测试。对于复杂或 专用的元件的失效,可以不用测试矢量也不用对
您可能关注的文档
- 《《5615-知识型企业人力资源管理挑战与e-HR应对策略》.doc
- 《《5778.拯救iPhone之电路与故障检修》.pdf
- 《《5806.IT&AT教育部实用型信息技术人才培养系列教材:Excel统计分析基础教程》.pdf
- 《《5、EE_FPGA基础教程系列_--_串口调试》.pdf
- 《《6 Transaction innovation and the role of the firm》.pdf
- 《《6.An Ideal Position》.doc
- 《《6091.iPhone4“玩”全攻略》.pdf
- 《《61_How to Configure iSCSI Advanced ACL on QNAP Turbo NAS》.docx
- 《《6341.玩转iPhone4》.pdf
- 《《65fsb-32l氟塑料合金离心泵》.pdf
文档评论(0)