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《jesd51-4 Thermal Test Chip Guideline (Wire Bond Type Chip)》.pdf
NOTICE
EIA/JEDEC Standards and Publications contain material that has been prepared, progressively
reviewed, and approved through the JEDEC Council level and subsequently reviewed and
approved by the EIA General Counsel.
EIA/JEDEC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchases, facilitating
interchangeability and improvement of products, and assisting the purchaser is selecting and
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such standards preclude their voluntary use by those other than EIA members, whether the
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assume any liability to any patent owner, nor does it assume any obligation whatever to parties
adopting the EIA/JEDEC Standards or Publications.
The information included in EIA/JEDEC Standards and Publications represents a sound
approach to product specification and application, principally from the solid state device
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