《jesd51-4 Thermal Test Chip Guideline (Wire Bond Type Chip)》.pdf

《jesd51-4 Thermal Test Chip Guideline (Wire Bond Type Chip)》.pdf

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《jesd51-4 Thermal Test Chip Guideline (Wire Bond Type Chip)》.pdf

NOTICE EIA/JEDEC Standards and Publications contain material that has been prepared, progressively reviewed, and approved through the JEDEC Council level and subsequently reviewed and approved by the EIA General Counsel. EIA/JEDEC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchases, facilitating interchangeability and improvement of products, and assisting the purchaser is selecting and obtaining with minimum delay the proper product for his particular need. Existence of such standards shall not in any respect preclude any member or nonmember of JEDEC from manufacturing or selling products not conforming to such standards, nor shall the existence of such standards preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. EIA/JEDEC Standards and Publications are adopted without regard to whether their adoption may involve patents or articles, materials, or processes. By such action, EIA/JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the EIA/JEDEC Standards or Publications. The information included in EIA/JEDEC Standards and Publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the EIA/JEDEC organization there are procedures whereby an EIA/JEDEC Standard or Publication may be further processed and ultimately becomes an ANSI/EIA Standard. Inquiries, comments, and suggestions relative to the content of this EIA/JEDEC Standard or Publication should be addressed to the JEDEC Executive Secretary at EIA Headquarters, 2500 Wilson Boulevard, Arlington, VA 22201. Published by

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