《10_Blanche_Working With Consortia - Advanced Packaging Reliability》.pdf

《10_Blanche_Working With Consortia - Advanced Packaging Reliability》.pdf

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《10_Blanche_Working With Consortia - Advanced Packaging Reliability》.pdf

NEPP Electronic Technology Workshop National Aeronautics and Space Administration June 22-24, 2010 Working With Consortia - Advanced Packaging Reliability Jim Blanche - Jacobs ESTS Group Mark Strickland – NASA/MSFC/ES43 Marshall Space Flight Center 1 Working With Consortia - Advanced Packaging Reliability Description: FY10 Plans: •Support the responsible NASA official for -Reliability data on lead-free solder applications lead-free solder evaluation for various part lead finishes and board finishes •Serve as the NASA technical liaison to the -Update lead-free solder risks and risk mitigation NASA/DoD Pb-free Project strategies for NASA •Assure NASA areas of interest are included in -Evaluate lead-free alloy/lead-free finish JG-PP follow-on work reliability in design application •Support NASA/DoD telcons and face-to-face -Status CAVE project on Pb-free solder aging meetings effects •Update MSFC lead-free solder lessons -Compile the LTESE flight and bench data learned report Schedule: Deliverables: •Updated MSFC Lead-free lessons learned 2009

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