《Challenges in the Packaging of MEMS》.pdf

1999 International Symposium on Advanced Packaging Materials Challenges inthe Packaging of MEMS Chad B. O’Neal, Ajay P. Malshe, Sushila B.Singh, and W.D. Brown; High Density Electronic Center (HiDEC), University of Arkansas, Fayetteville, AR; William P. Eaton; Sandia National Laboratories, Albuquerque, NM. Extended Abstract Introduction Microelectromechanical Systems (MEMS) consist of [l]. Bulk micromachining is used to fabricate structures mechanical devices and machine components ranging in like cantilevers, bridges, or channels, as well asmany more size from a few microns to a few hundred microns. They complicated devices [11. HARM includes processes such as can be the mechanical interconnects of microsystems, and LIGA and deep silicon R E [l]. LIGA is a micromolding can be categorized as either sensors or actuators. These process, which very few companies or research institutions devices generally integrate signals from one physical are capable of doing. These HARM processes are able to domain to another, such as mechanical-to-electrical, create free standing structuresup to a few hundred microns electrical-to- mechanical, electrical-to-chemical. in height [l]. MEMS sensors are devices such as pressure sensors, MEMS fabrication also differs from IC fabrication in other accelerometers, and gyrometers that perceive an aspect of ways. For instance, MEMS do not currently follow the VLSI their environment and produce a corresponding output paradigm. The development cycle is long and often several signal. Actuators are devices that are given a specificinput cycles arerequired to comply with design specifications [3]. signal on which to act and a specific motion or action is This is because often th