Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces》.pdfVIP

Applied Surface Science 353 (2015) 774–780 Contents lists available at ScienceDirect Applied Surface Science j o u rn al h o m e p a g e : w w w. elsev /locate/aps usc Effects of Ni–W(Au) coated Cu microcones on the bonding interfaces Fengtian Hu, Haozhe Wang, Shan Yang, Anmin Hu ∗ , Ming Li State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China a r t i c l e i n f o a b s t r a c t Article history: Nickel-based alloys are being studied a lot currently in an effort to develop stable barrier films between Received 23 April 2015 solder and copper substrate. In this paper, electroplated Ni–21.4%W(Au) coating on the surfaces of copper Received in revised form 6 June 2015 microcones applying in low temperature solid state bonding has been investigated. X-ray diffraction Accepted 29 June 2015 (XRD) and scanning electron microscopy (SEM) result show that there is no significant change of the Available online 11 July 2015 surface morphology Cu microcones after plating Ni–W(Au) film. SEM analysis revealed that the Ni–W alloys coating can effectively reduce the interfacial reaction and improve high-temperature anticorrosion Keywords: prominently in the bonding process. A thin