Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays The roles of Cu pre-plating and barrier layer temperature》.pdf
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Electrodeposition efficiency of Ni in the fabrication of highly ordered nanowire arrays The roles of Cu pre-plating and barrier layer temperature》.pdf
Applied Surface Science 356 (2015) 687–694
Contents lists available at ScienceDirect
Applied Surface Science
j o u r n a l h o m e p a g e: w w w. elsev /locate/aps usc
Electrodeposition efficiency of Ni in the fabrication of highly ordered
nanowire arrays: The roles of Cu pre-plating and barrier layer
temperature
M. Ahmadzadeh a , M. Almasi-Kashi a,b,∗ , A. Ramazani a,b , A.H. Montazer b
a Department of Physics, University of Kashan, Kashan 87317-51167, Iran
b Institute of Nanoscience and Nanotechnology, University of Kashan, Kashan 87317-51167, Iran
a r t i c l e i n f o a b s t r a c t
Article history: Investigation of new parameters affecting the electrodeposition process of nanowires (NWs) grown in
Received 10 March 2015 solid templates is of considerable significance. In this work, the electrodeposition efficiency (EE) of Ni
Received in revised form 8 July 2015 in the fabrication of arrays of pulsed ac electrodeposited NWs embedded in porous aluminum oxide
Accepted 13 August 2015
template was investigated. By filling the branched nanopores formed at the bottom of aligned pores
Available online 15 August 2015
with Cu prior to the electrodeposition of Ni and also optimizing the alumina barrier layer temperature
(T 2
BL ), a steady-state electrodeposit
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