Fabrication of a CuNi stack in supercritical carbon dioxide at low-temperature》.pdf

Thin Solid Films 591 (2015) 13–17 Contents lists available at ScienceDirect Thin Solid Films journal homepage: /locate/tsf Fabrication of a Cu/Ni stack in supercritical carbon dioxide at low-temperature Md Rasadujjaman a,b,⁎, Mitsuhiro Watanabe a, Hiroshi Sudoh c, Hideaki Machida c, Eiichi Kondoh a a Interdisciplinary Graduate School of Medicine and Engineering, University of Yamanashi, 4-3-11 Takeda, Kofu, Yamanashi 400-8511, Japan b Department of Physics, Dhaka University of Engineering Technology, Gazipur 1700, Bangladesh c Gas-Phase Growth Ltd., 2-24-16 Naka, Koganei, Tokyo 184-0012, Japan a r t i c l e i n f o a b s t r a c t Article history: We report the low-temperature deposition of Cu on a Ni-lined substrate in supercritical carbon dioxide. A novel Received 4 May 2015 Cu(I) amidinate precursor was used to reduce the deposition temperature. From the temperature dependence of Received in revised form 24 July 2015 the growth rate, the activation energy for Cu growth on the Ni film was determined to be 0.19 eV. The films and Accepted 11 August 2015 interfaces were characterized by Auger electron spectroscopy. At low temperature (140 °C), we successfully de- Available online 13 August 2015 posited a Cu/Ni stack with a sharp Cu/Ni interface. The stack had a high adhesion strength (N 1000 mN) according to microscratch testing. The high adhesion strength originated from strong int