berkley_半导体工艺讲义15--湿法刻蚀.pdf

EE143 F05 Lecture 15 Etching • Etching Terminology • Etching Considerations for ICs • Wet Etching • Reactive Ion Etching (plasma etching) Professor N Cheung, U.C. Berkeley 1 EE143 F05 Lecture 15 Etch Process - Figures of Merit • Etch rate • Etch rate uniformity • Selectivity • Anisotropy Professor N Cheung, U.C. Berkeley 2 EE143 F05 Lecture 15 (1) Bias dm etching mask h f film Bias B ≡ d − d substrate f m d B can be 0 or 0. f d m substrate d f Professor N Cheung, U.C. Berkeley 3 EE143 F05 Lecture 15 Complete Isotropic Etching Vertical Etching = Lateral Etching Rate B = 2×h f Complete Anisotropic Etching Lateral Etching rate = 0 B = 0 Professor N Cheung, U.C. Berkeley