Group Meeting(北京大学微电子学研究院,方东明)17259.ppt

Group Meeting Dong-Ming Fang Work in the last two weeks Work in the last two weeks Completed PPT file for oral speech Work in the last two weeks Thesis draft written by…Work in the last two weeks Processes Information Storage Work in the last two weeks References and PPT filesWork in the last two weeks Safety and Operation Handbook Future work in the next week Work in the last week Work in the last week Work in the last month Work in the last month Work in the last month Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the last two months Work in the future Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in the last two weeks Work in July and in this term Work in July and in this term Work in July and in this term Work in July and in this term Work in the past two weeks fangdm@ime.pku.edu.cn 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 图3 RF MEMS VCO测试框图 LIGA技术 LIGA技术 准LIGA技术 SLIGA技术 电镀 ( Galvanoformung) 压模(Abformung) 光刻 (Lithographie) 衬底必须是导体或涂有导电材料 1 能实现大深宽比结构 2 材料广泛 3 制作高精度复杂图形 4 易于大批量生产 5 不适合制作多层结构 6 LIGA技术特点 硅/硅键合 1、灵活性和半导体工艺兼容性 2、温度在键合过程中起着关键的作用 3、硅片表面的平整度和清洁度 硅/玻璃键合 1、两静电键合材料的热膨胀系数近似匹配 2、阳极的形状影响键合效果 3、表面状况对键合力