PARCAMMANUAL-misc1.doc

Miscellaneous Stackup Module Stackup is a fully interactive piece of software that allows you to dictate the layout of the board layers for manufacturing. You can insert and remove B-stage (prepreg) materials, Core materials, and Dummy layers. You can also set the Layer name and ID for independent layers, which includes listing the material type, emulsion direction, mirroring, thickness, trace width, and layer scaling. Using Board Stackup When first entered, your board defaults to a FOIL stackup. There are two default stackup types and a custom stackup setup. The defaults are FOIL and CORE. The differences between these are displayed in Figure 1 using a 6-layer board as an example. Foil Setup Core Setup Foil/Conducting Layer 1 Foil/Conducting Layer 1 B-Stage/Prepreg Material Core Material Foil/Conducting Layer 2 Foil/Conducting Layer 2 Core Material B-Stage/Prepreg Material Foil/Conducting Layer 3 Foil/Conducting Layer 3 B-Stage/Prepreg Material Core Material Foil/Conducting Layer 4 Foil/Conducting Layer 4 Core Material B-Stage/Prepreg Material Foil/Conducting Layer 5 Foil/Conducting Layer 5 B-Stage/Prepreg Material Core Material Foil/Conducting Layer 6 Foil/Conducting Layer 6 Figure 1: Differences between Foil and Core Default Setups The Custom Setup allows you to place Core and B-Stage material wherever you wish. To select one of the default layouts, click on the button corresponding to that layout type at the top of the Main Stackup form (Figure 2, below). You should then see the stackup layout of the selected type, in the display area. The Main Stackup Form Access Stackup by clicking on the Board Stackup button on the Control Panel. The Main Stackup form displays. Figure 2: Main Stackup Form This form presents the following information and selection buttons. Construction Type By clicking on Foil or Core, the board stackup defaults to either Foil or Core types. By clicking Custom, th