PCBVisionWebsite.doc

Rigid board production Materials: FR4 , FR4 Tg150, Tg170 and T80, Halogen free FR4, Rogers, Teflon, Arlon, Metal Based (Aluminum, Copper), Mix material Layer account: 1-38 PCB final thickness: .005 to .315 Min. trace: .003 - Min. space .003 Min. finished hole size: .004(laser drilling), 0.006(mechanical drilling) Start copper weight: 1/3 to 28oz Surface finish: HASL, HAL Lead Free, OSP, Immersion Gold, Immersion Silver, Gold Flash, Immersion Tin, Selective Gold (Au: 50uinch), Gold Fingers (Au: 3-50uinch) Controlled impedance, unbalanced dielectric thickness. Plated slots and edges. Peelable mask, Carbon ink, Capton tape. Conductive silver/carbon filled via. Counter sink, Tapped hole. Blind via, buried via, via in pad, HDI (1+N+1, 2+N+2, 3+N+3). Rigid board tolerances Copper to edge of PCB: Routing: Min. 0.008 for outer layer and 0.014 for inner layers (0.020 preferred for inner layers) V-cut: Min. 0.015 for outer layers and 0.020 for inner layers Pad size/Annular ring Pad size - + 0.006 over finished via size  + 0.012 over finished component hole size Annular ring (radius of the pad) + 0.003 for via + 0.006 (Min.) for component holes Hole size PTH +/-0.002, NPTH +/-0.001 based on 1 oz and 2 oz Min. finished hole size: 0.004 Rout/Punch (Board outline) +/- 0.004 for production Note: rout/Punch to board size using the center of the board outline on mask layer PCB finished thickness Overall may vary +/- 10% (Min. +/- .004) 2Layer: 0.005 - 0.236 4Layer: 0.020 - 0.315 6Layer: 0.031 - 0.315 8Layer: 0.047 - 0.315 10Layer: 0.062 - 0.315 Inner layer clearances: Min. 0.008 Inner layer thickness tolerance: +/-0.001 Trace width/spacing 0.5oz finished Min. trace width/space 0.003 (inner outer) 1oz finished Min. trace width/space 0.004 (inner outer) 2oz finished Min. trace width/space 0.008 (inner outer) 3oz finished Min. trace width/space 0.010 (inner outer) 4oz finished Min. trace width/space 0.012 (inner outer) Solde