SOP封装工艺流程介绍..pptx

SOP ASSEMBLY PROCESS FLOW QUALITY CONTROL INSTRUCTIONContentsPackage InstructionProcess FlowQuality ControlASEASEPackage Instruction3. TSSOPSOPSSOP4. MFPPackage InstructionLaser MarkingLead FrameEpoxyLaser MarkingASY process flow后段制程前段制程WaferMoldingWafer GrindingLaser MarkingWafer MountPost Mold CureWafer SawDie (chip)De-junkLaser MarkingLaser MarkingDie Attach BeforeAfterDie on Lead frameEpoxy Cure PlatingWire Bond Trim/FormPacking Shipping晶圓 (研磨後)晶圓 (未研磨)Wafer GrindingWafer GrindingPurpose:Grinding the wafer to Customer required thicknessUNLOADGRINGINGLOAD研磨機Wafer MountPurpose: Combine the wafer with Dicing tape onto the frame for die sawingWafer mount MachineMount Tape晶元背面Wafer backsideFrameFrameWafer SawPurpose: To separate dies from each other for die attachMachineMonitorCleaningSawingLoad/UnloadWafer SawBefore wafer saw:After wafer saw:Die AttachPurpose:Attach the dies with epoxy on substrate for the following processOutputSubstrate load bondDie bondEpoxyDie AttachWorking flow:Robber tipLead-frameEpoxy CurePurpose: Solidify the epoxy after D/AInsideOvenGold wireinputoutputBond locationCapillaryDieAl padleadWire BondPurpose: Connecting the chip and the exterior circuitTheory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag…)inputMoldingPurpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic.Mold MachineMoldingTop cull blockRunner Cavity Gate insertTop chaseMoldingAir vent Leadframe CompoundBottom chase PotBottom cull blockPlunger MoldingTop cull blockRunner Cavity Gate insertTop chaseMoldingAir vent Leadframe CompoundBottom chase PotBottom cull blockPlunger MoldingTop cull blockRunner Cavity Gate insertTop chaseMoldingAir vent Leadframe CompoundBottom chase PotBottom cull blockPlunger Lead FrameEpoxyMoldingTop cull blockRunner Cavity Gate insertTop chaseMoldingAir vent Leadframe CompoundBottom chase PotBottom cull blockPlunger After MoldLaser MarkingPu