[Array工艺技术基础.ppt

System Components Automated cassette load station ACLS (optional) Copyright BOE Technology Group Company Confidential * B2 Project Team Change life with heart Change life with heart Array 工艺技术简介 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Array工艺构成 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Thin-Film --- EQP ---L/UL Chamber：在ATM和Vacuum两个状态之间传送Glass的Chamber ---Transfer Chamber：把玻璃基板在各个周边的Chamber之间进行传送的Chamber，内有一个Vacuum Robot。 ---Sputter Chamber：进行Deposition的Chamber。 Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Sputter Chamber的主要构成有： ---Platen：用来放玻璃基板（Gate 有2个,SD、ITO为1个） ---Cathode： 包括Target 、Shield 、Magnet Bar等构成部分 ---Motor: 有Plate转动的Motor 、Plate 升降的Cylinder、Cathode开关的Motor 、 Magnetic Bar运动的Motor等。 Sputter-SP Chamber Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. The system hardware consists of three major components: Mainframe Remote modules Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Remote Support Equipment Heat Exchanger The heat exchanger provides DI water to the RF match for cooling purposes Process Pumps Provides vacuum to the process chambers RF generator The RF generator supplies Radio Frequency to the process chamber for the purpose of creating a plasma Mainframe Pump Provides vacuum to the transfer and loadlock chambers. Remote AC Power Box Facility power is connected from customer facilities to the remote AC power box on the remote service module All electrical power to the system is distributed from the AC power box Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Deposition --- PECVD GAS IN Plasma GAS OUT Glass ~