双马树脂的改性.doc

一种低介电双马树脂改性剂的设计合成 目录 第一章 绪论 1 1.1双马来酰亚胺树脂 1 1.1.1 双马来酰亚胺的概述 1 1.1.2双马来酰亚胺树脂改性的方法 2 1.2 覆铜板的发展概况 4 1.2.1BMI树脂在覆铜板的应用以及覆铜板材料对BMI的要求 4 1.3 本论文的主要方法和研究进展 5 1.4研究目标 5 第二章 实验 6 2.1 合成路线 6 2.2 实验部分 7 2.2.1仪器与试剂 7 2.2.2 实验方法 8 2.2.3实验检测 9 2.2.4结果与讨论： 12 参考文献 15 致 谢 15  摘 要 随着科学技术的发展，信息的传递进入高频时代，为了实现信息传递的高频化和高速化，制作基板的材料的介电常数和介质损耗因数必须非常的小。双马来酰亚胺树脂体系是制备基板的重要材料之一。因为它有非常好的耐高温、耐辐射、耐湿热性能，还有吸湿性低和热膨胀系数小等优良特性，克服了环氧树脂因为耐热性相对较低和聚酰亚胺树脂成型温度相对较高的缺点。然而它也具有单体的溶解性差、加工工艺差、固化物脆性高和韧性差等缺陷，仅仅只有双马来酰亚胺单体并无使用价值。因此要对马来酰亚胺树脂进行韧性强度的改性，使其既能耐高温又能容易加工。本论文是利用氯丙烯与热塑性酚醛树脂进行反应，然后重排，再与溴乙烷反应，得到产物。将产物作为固化剂对双马来酰亚胺树脂体系进行改性，既提高树脂的韧性强度，又降低介电常数。 关键词：双马来酰亚胺； 氯丙烯； Claisen重排； 溴乙烷  Abstract With the development of science and technology, the transfer of information enters era of high-frequency. In order to realize the high frequency and high speed of information transfer, the dielectric constant and dielectric loss factor of the substrate material must be very small. Bismaleimide resin system is one of the important materials for preparing the substrate material. Because it has the excellent properties of thermostable and chemical corrosion resistance, radiolytic stability, and electrothermal, and it also has low moisture absorption and excellent features of small thermal expansion coefficient. The heat resistance of epoxy resin is relatively low and the molding temperature of polyimide resin is relatively higher. However, the solubility of monomer is poor, and the application of BMI resin in the higher-requested fields is limited as its brittleness and poor thermal properties. So we need to modification was carried out on the BMI, and the modified resin had good toughness, high temperature resistance and excellent electrical insulation property.We use allyl chloride to react with thermoplastic phenolic resin and then rearranged.The last, the substance reacts with ethyl bromide to give the product. The product as a curing agent for bismaleimide resin system