PCB Process flow1专用课件.pptVIP

PCB Process Flow Topsearch Printed Circuit Ltd. PCB Manufacturing Process Flow-Introduction General introduction of PCB process flow Sub-processes introduction Product from sub-process Machine/ Equipment for sub-process 1. Board Cut Laminates are cut to size for down stream process 2. Inner Layer Process Image transfer create inner layer circuitry Cleaning Lamination/ Coating Exposure Developing Etching Coating Stripping Oxide treatment Inner layer Image Transfer Machines Inner layer Image Transfer Machines Inner layer Image Transfer Machines Inner layer machines Inner layer Inspection Machines Inner layer machines 3. Pressing Process Pressing Lay-up: laminates, copper foils and prepreg are aligned and bonded for pressing The layup structure are pressed to form multi-layer PCB Lay-up Laminates, prepreg and copper foils are lay-up for pressing Pressing 4. Drilling Process Holes are drilled for connections between different layers Drilling Process Capacity: Drilling Process Capability: Drilling Machine 5. Outer Layer Process Plate through hole creates conductive copper coating on drilled hole wall surfaces Image transfer creates outer layer circuitry coating Copper plating increases the outer layer copper thickness Etching and Coating Stripping forms outer layer circuitry Plating Through hole equipment Outer layer Image Transfer Machines Outer layer Image Transfer Machines Outer layer Image Transfer Machines Copper Plating Equipment Copper Plating Equipment Both AC and DC rectifiers are used in Topsearch for products with different characteristics Etching and Stripping Machines Etching and Stripping Line 6. Solder Mask Process Creates protective insulation coating against environmental attack and facilitates assembly surface coating image transfer legend printing final curing Solder mask process machines Print surface solder mask and hole plugging Solder mask process machines Component mark machines 7. Surface Finishing Process Creates conductive protec