DrRouSputterProcessIntroduction.pptVIP

Education Series(Sputter Process Introduction) Alex S Rou Myself Born and grew up in Tainan, Taiwan. Graduated from Tsing-Hua University. Materials Science and Engineering Auburn University Master. Metallurgy. Impurity to impact strength of high radiation steel. North Carolina State University Ph.D. Intern in Microelectronic Center of NC Ion beam deposition and TEM characterization of Epitaxial Film. Characterization of Ferroelectric and Optoelectronic Perovskite Thin Film. Post Doctor for almost two years. Myself Joint Hard Disk Drive Industry HMT Technology, Media Manufacture – Media sputter Engineer ReadRite Inc., Thin film magnetic recording head design, process integration, electrical and magnetic characterization. Seagate Technology, Media manufacture – Bring up Fremont sputter production line. World wide product launch – Establish product transfer system. Media engineering pilot line operation – Fremont. New product design – next generation media design for Seagate new hard disk drive products. (Customer interface from supplier side) Media RD : Technology building blocks, New characteristic, New architecture, New process innovation, and New sputter tools/hardware. Intervac 200L (Disk Sputtering Tool) Sputter Component Vacuum System Pump. Chamber. Substrate Transportation. Gas delivery system. Cathode Target. Power supply. Mag packs for magnetron sputtering. Shield and clamp ring. Water channel for target cooling. Vacuum Pump High pressure region (atm to 10-4Torr) Mechanical Pump. Scroll Pump. /wiki/File:Two_moving_spirals_scroll_pump.gif Rotory Pump. Vacuum Pump Low pressure region (10-4Torr to 10-8Torr) Diffusion Pump. (Solar) Turbo molecular pump. Cryo pump. (Cold trap) Ion Pump ( 10-8Torr) Gas Delivery System Mass flow control Deliver desired and well quantified gases to the chamber. /upload/File /White_Papers/SL-MFCFUND-270-01.pdf Cathode Ar+ S Cathode Power Supply 。 Sputter Process Animation /en/technology/_sputteringbasics/sputterin