集成电路塑封自动上料机机架部件设计及性能试验.doc

摘 要 本课题结合纵向科研项目“集成电路塑封自动上料机研制”研究需要，首先进行了课题总体技术方案设计，然后进行了集成电路芯片塑料封装自动上料系统的机架部件结构设计及性能试验方案的拟定。自动上料系统的研制实现了集成电路塑封的自动化，该系统适用于DIP、QFP、SOPABSTRACT Based on the longitudinal research topic “IC Plastic automatic feeding machine” research needs, firstly the issue of the overall technical program was designed, then the IC chip plastic packages automatic feeding system on the rack components was designed and the performance was tested. An automatic leader system was designed that realized automation for plastic package of integrated circuit. The system can be applied to the plastic package for DIP、QFP、SOP and TO series integrated circuits. The production efficiency and the product quality would be improved greatly. The system consists mainly of transmission components, materials unit automatic film parts, industrial computer systems, sensing detection system and the rack components and so on. The rack components of the automatic feeding machine was made by Sheet-metal structure, the structure is simple and easy to use. The rack components as an important infrastructure components of the feeding machine, it play a role in supporting workstations, installation and protection of electronic equipment within various circuit modules, electrical components and other important components. Key words: Integrated circuit, Plastic package, Load, Automation, Rack components 目 录 摘 要 I ABSTRACT II 第一章 绪 论 1 1.1课题研究的现状及发展趋势 1 1.2课题研究的基本内容 2 1.3 2 第二章 集成电路封装概述 4 2.1 集成电路 4 2.1.1 概念 2.1.2 类型 4 2.1.3 集成电路在我国的发展状况 5 22 集成电路封装 5 2.2.1 封装的发展 5 2.2.2 塑料封装 7 2.2.3 环境因素对封装的影响 7 2.3 封装设备 9 2.3.1 集成电路芯片塑料封装设备 9 2.3.2 国内外集成电路塑封设备的概况 10 2.4 机电一体化系统（产品）的设计 10 第三章 上料机系统设计 12 3.1 系统总体设计 12 3.1.1集成电路塑封上料的技术要求及其指标 12 3.1.2系统组成及工作过程 12 3.1.3系统特点 14 3.2上料机机架部件结构设计 14 3.2.1机架部件设计准则 14 3.2.2机架部件结构设计 15 3.3性能试验方案拟定 17 第四章 结论与展望 20 参考文献 21 致 谢 22 第一章 绪 论 课题研究的现状及发展趋势 集成电路（IC）是现代信息产业和信息社会的基础，是改造和提升我国传统产业的核心技术。近年来，我国集成电路产业发展迅猛，已成为国家经济发展的主要驱动力量之一。在构成集成电路产业的三大支柱(IC设计、IC制造和IC封装)之中，