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Bond-Ply 800粘结层800
Bond-Ply? 800
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits
? Thermal impedance: 0.60°C-in2/W (@50 psi)
? High bond strength to most epoxies and metals
? Double-sided, pressure sensitive adhesive tape
? High performance, thermally conductive acrylic adhesive
? More cost-effective than heat-cure adhesive, screw mounting or clip mounting
Bond-Ply? 800 is a thermally conductive, electrically isolating double-sided tape. Bond-Ply? 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient temperature lead to significant processing cost savings in labor, materials and throughput due to the elimination of mechanical fasteners and high temperature curing.
Typical Applications Include:
? Mount LED assembly to troffer housing ? Mount LED assembly to heat sink ? Mount heat spreader onto power
converter PCB or onto motor control PCB ? Mount heat sink to BGA graphic processor or drive processor
PROPERTY Color
TYPICAL PROPERTIES OF BOND-PLY 800
IMPERIAL VALUE METRIC VALUE TEST METHOD Gray Gray Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005, 0.008
0.127, 0.203
ASTM D374
Elongation (%, 45° to Warp Fill)
70
70 ASTM D412
Tensile Strength (psi) / (MPa)
1500
10 ASTM D412
CTE (um/m-°C), -40°C to +125°C
600
600 ASTM D3386
Continuous Use Temp (°F) / (°C)
-40 to 257
-40 to 125
—
ADHESION Lap Shear @ RT (psi) / (MPa) (1)
150
1.0 ASTM D1002
ELECTRICAL Dielectric Breakdown Voltage (Vac), 0.005
VALUE 4000
TEST METHOD ASTM D149
Dielectric Breakdown Voltage (Vac), 0.008
6000
ASTM D149
Dielectric Constant (1000 Hz)
4.0 ASTM D150
Volume Resistivity (Ohm-meter)
1011 ASTM D257
THERMAL Thermal Conductivity (W/m-K)
0.8 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE Initial Assembly Pressure (psi for 5 seconds) 10 25 50 100 200
TO-220 Thermal Performance (°C/W), 0.005 5.0 5.0 4.8 4.3 4.2
TO-220 Thermal Performance (°C/W), 0.008 6.2 6.0 5.6 5.
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