- 1、本文档共13页,可阅读全部内容。
- 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
DT082332 MOA4 Contactless Chip Card Module Specification
1. General description
1.1 Definition of a Chip Card Module
A chip card module is a packaged chip, which is electrically connected with a metal
lead-frame and encapsulated with a mold cap.
The chip card module is used, e.g. for further lamination into contactless Smart Cards
according to ISO 14443. It can also be incorporated into e.g. disc-shaped data carriers.
The chip card module is best suited for automated high volume ISO chip card production
or RF transponder production.
1.2 Use of the Chip Card Module
The chip card module is designed for connection to a coil and incorporation into a Smart
Card (by lamination etc.) or RF transponder. Specific processing information for
coil-module interconnection and packaging is given in this specification.
MOA4
Contactless Chip Card Module Specification
Rev. 3.2 — 3 August 2006 Product data sheet
082332 CONFIDENTIAL
Philips Semiconductors MOA4
Contactless Chip Card Module Specification
CONFIDENTIAL1.3 Smart Card contactless module
Fig 1. Contact assignments for SOT500BA2 (MOA4).
Table 1. Bonding pad assignments to Smart Card contactless module
Contactless Interface Module MOA4
Antenna Contacts Symbol Description
LA LA Antenna coil connection LA
LB LB Antenna coil connection LB082332 ? Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 3.2 — 3 August 2006 2 of 13
Philips Semiconductors MOA4
Contactless Chip Card Module Specification
CONFIDENTIAL2. Specifications
2.1 Chip
For details on functionality and electrical characteristics of the IC see Addendum and
respective Data Sheet.
2.2 Mechanical Properties
Table 2. General dimensions
All dimensions in millimeter (mm)
Module Options PLLMC = Plastic Leadless Module Chip Carrier
Package
Name
Outline
Code
Tape Format Module Size Encapsulation
Size
Overall
Thickness
Size of Antenna
Connection Area
Contactless Chip Card Module
PLLMC-07 MOA4
SOT500BA2
Super 35 mm
Pitch: 9.5 ± 0.02
3 rows matrix
proposedpunching
outline: 5.15 × 8.10
4.80 ± 0.03 x
5.
您可能关注的文档
- Contact angle hysteresis of cylindrical drops on chemically heterogeneous striped surfaces.pdf
- Contactless 360° absolute angular CMOS microsystem based on vertical Hall sensors.pdf
- Contents Title ”Operator Theory Arising from Systems Engineering”.pdf
- Context Sensitive Anomaly Monitoring of Process Control Flow to Detect Mimicry £ Attacks a.pdf
- Context Shadow A Person-Centric Infrastructure for Context Aware Computing.pdf
- Context-Sensitive Referencing for Ontology Mapping Disambiguation.pdf
- Context-Sensitive Binding by the Laminar Circuits of V1 and V2 Unified Model Perceptual Gro.pdf
- Context-Sensitive Spoken Dialogue Processing with the DOP Model.pdf
- Continuity of the Complex Monge-Ampere Operator on Compact Kahler Manifolds.pdf
- Continuum Field Model of Street Canyon Theoretical Description Part I.pdf
最近下载
- 废旧塑料购销合同6篇.docx VIP
- 山东省烟台市芝罘区2022-2023学年七年级(五四学制)上学期期中地理试题(含答案).docx VIP
- 建筑工程施工技术交底大全.docx
- 柔性光伏钢构及组件安装施工方案.docx VIP
- 中成药学讲稿祛暑中成药.docx VIP
- 石油化工企业设计防火规范(GB50160-2018-).doc
- 山东省烟台市芝罘区(五四制)2023-2024学年六年级上学期期中考试生物试题(解析版).docx VIP
- 医疗机构医院感染管理专职人员管理办法(2020年版).pdf
- 南宁师范大学信息技术课程与教学考研真题试题2019年.pdf
- 加强风电设备管理提升风机可利用率(电力系统及自动化范文).doc
文档评论(0)