DT082332 MOA4 Contactless Chip Card Module Specification.pdf

DT082332 MOA4 Contactless Chip Card Module Specification.pdf

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DT082332 MOA4 Contactless Chip Card Module Specification

1. General description 1.1 Definition of a Chip Card Module A chip card module is a packaged chip, which is electrically connected with a metal lead-frame and encapsulated with a mold cap. The chip card module is used, e.g. for further lamination into contactless Smart Cards according to ISO 14443. It can also be incorporated into e.g. disc-shaped data carriers. The chip card module is best suited for automated high volume ISO chip card production or RF transponder production. 1.2 Use of the Chip Card Module The chip card module is designed for connection to a coil and incorporation into a Smart Card (by lamination etc.) or RF transponder. Specific processing information for coil-module interconnection and packaging is given in this specification. MOA4 Contactless Chip Card Module Specification Rev. 3.2 — 3 August 2006 Product data sheet 082332 CONFIDENTIAL Philips Semiconductors MOA4 Contactless Chip Card Module Specification CONFIDENTIAL1.3 Smart Card contactless module Fig 1. Contact assignments for SOT500BA2 (MOA4). Table 1. Bonding pad assignments to Smart Card contactless module Contactless Interface Module MOA4 Antenna Contacts Symbol Description LA LA Antenna coil connection LA LB LB Antenna coil connection LB082332 ? Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 3.2 — 3 August 2006 2 of 13 Philips Semiconductors MOA4 Contactless Chip Card Module Specification CONFIDENTIAL2. Specifications 2.1 Chip For details on functionality and electrical characteristics of the IC see Addendum and respective Data Sheet. 2.2 Mechanical Properties Table 2. General dimensions All dimensions in millimeter (mm) Module Options PLLMC = Plastic Leadless Module Chip Carrier Package Name Outline Code Tape Format Module Size Encapsulation Size Overall Thickness Size of Antenna Connection Area Contactless Chip Card Module PLLMC-07 MOA4 SOT500BA2 Super 35 mm Pitch: 9.5 ± 0.02 3 rows matrix proposedpunching outline: 5.15 × 8.10 4.80 ± 0.03 x 5.

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