Thermal Control of an Airborne Electronics Bay.pdf

Thermal Control of an Airborne Electronics Bay.pdf

  1. 1、本文档共16页,可阅读全部内容。
  2. 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
  3. 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载
  4. 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
Thermal Control of an Airborne Electronics Bay

1Thermal Control of an Airborne Electronics Bay Michel Engelhardt, Sr. Principal Engineer II, Mechanical Engineering BAE Systems Inc., NES, 450 Pulaski Road MS 01-E10, Greenlawn, New York 11740 United States (631) 912-2769 FAX (631) 912-2721 michel.engelhardt@ An integrated thermal management system controls the temperature of an Electronics Bay located in a fighter aircraft pod within a prescribed temperature setting and temperature tolerance. The thermal management system integrates an open loop Air Cycle Machine (ACM) Environmental Control System (ECS) with a closed loop Thermal Control System (TCS). The ACM provides uncontrolled cooling to the closed loop TCS via an air-to-air cross flow heat exchanger. The main components of the ECS are the ACM, ram air inlet scoop/outlet, heat exchanger, and ducting. The TCS includes an innovative thermal control system, an effective in-line duct heater, an airframe skin thermal blanket, desiccant, and an air circulation fan. In addition, the TCS controls the Relative Humidity (RH) in the Electronics Bay throughout the mission of the aircraft. In-flight thermal analyses and test result indicate that the Electronics Bay temperature can be controlled by the TCS within +1° C of its prescribed temperature setting at take-off without condensation of moisture. The electronics bay temperatures are held between preset lower and upper bound temperatures throughout typical high performance aircraft missions. This paper describes the TCS and ECS components used to control the Electronics Bay air temperature, humidity, and pressure. In addition, this paper provides a summary of the thermal-fluid analytical models, TCS and ECS performance predictions, and comparison against test data. Nomenclature Ac = Surface area for convective heat transfer Ai = Internal air flow area of the i th duct section AK = Area for conduction heat transfer Ar = Area for radiation heat transfer As = Area for heat transfer into the heat exchanger Cp = Specific hea

文档评论(0)

l215322 + 关注
实名认证
内容提供者

该用户很懒,什么也没介绍

1亿VIP精品文档

相关文档