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Thermal Control of an Airborne Electronics Bay
1Thermal Control of an Airborne Electronics Bay
Michel Engelhardt, Sr. Principal Engineer II, Mechanical Engineering
BAE Systems Inc., NES, 450 Pulaski Road MS 01-E10, Greenlawn, New York 11740 United States
(631) 912-2769 FAX (631) 912-2721
michel.engelhardt@
An integrated thermal management system controls the temperature of an Electronics Bay located in
a fighter aircraft pod within a prescribed temperature setting and temperature tolerance. The
thermal management system integrates an open loop Air Cycle Machine (ACM) Environmental
Control System (ECS) with a closed loop Thermal Control System (TCS). The ACM provides
uncontrolled cooling to the closed loop TCS via an air-to-air cross flow heat exchanger. The main
components of the ECS are the ACM, ram air inlet scoop/outlet, heat exchanger, and ducting. The
TCS includes an innovative thermal control system, an effective in-line duct heater, an airframe skin
thermal blanket, desiccant, and an air circulation fan. In addition, the TCS controls the Relative
Humidity (RH) in the Electronics Bay throughout the mission of the aircraft. In-flight thermal
analyses and test result indicate that the Electronics Bay temperature can be controlled by the TCS
within +1° C of its prescribed temperature setting at take-off without condensation of moisture. The
electronics bay temperatures are held between preset lower and upper bound temperatures
throughout typical high performance aircraft missions. This paper describes the TCS and ECS
components used to control the Electronics Bay air temperature, humidity, and pressure. In
addition, this paper provides a summary of the thermal-fluid analytical models, TCS and ECS
performance predictions, and comparison against test data.
Nomenclature
Ac = Surface area for convective heat transfer
Ai = Internal air flow area of the i
th
duct section
AK = Area for conduction heat transfer
Ar = Area for radiation heat transfer
As = Area for heat transfer into the heat exchanger
Cp = Specific hea
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