4-6-焊点质量评定及IPC-A-610C(D)介绍-(下).pdf

8.2.2.9.2 Chip Components – Rectangular or Square End Components – 1, 3or 5 Side Termination, Termination Variations – Mounting Upside Down Target - Class 1,2,3 ? Element of chip component with exposed deposited electrical element is mounted away from the board. Acceptable - Class 1 Process Indicator - Class 2,3 ? Element of chip component with exposed deposited electrical element is mounted toward the board. Chip元件翻面 8.2.2.9.3 Chip Components – Rectangular or Square End Components –1, 3 or 5 Side Termination, Termination Variations - Stacking Acceptable - Class 1,2,3 ? When permitted by drawing. ? All components meet the criteria of Table 8-2, features B through W for the applicable class of acceptance. ? Side overhang does not preclude formation of required solder fillets. Defect - Class 1,2,3 ? Stacked parts when not required by drawing. ? All components do not meet the criteria of Table 8-2, features B through W, for the applicable class of acceptance. ? Side overhang precludes formation of required solder fillets. Chip元件堆叠 8.2.2.9.4 Chip Components – Rectangular or Square End Components –1, 3 or 5 Side Termination, Termination Variations – Tombstoning Defect - Class 1,2,3 ? Chip components standing on a terminal end (tombstoning). Chip元件墓碑 8.2.3 Cylindrical End Cap (MELF) Termination 8.2.3.1 Cylindrical End Cap Termination, Side Overhang (A) Target Condition - Class 1,2,3 ? No side overhang. Acceptable - Class 1,2,3 ? Side overhang (A) is less than 25% diameter of component width (W) or land width (P), whichever is less. Defect - Class 1,2,3 ? Side overhang (A) is greater than 25% of component diameter, (W), or land width (P), whichever is less. 8.2.4 Castellated Terminations城堡形的无铅芯片载体 城堡形的 8.2.5 Flat Ribbon, L, and Gull Wing Leads 8.2.5.1 Flat Ribbon, L, and Gull Wing Leads, Side Overhang (A) Acceptable - Class 1,2 ? Maximum overhang (A) is not greater than 50% lead width(W) or 0.5 mm [0.02 in], whichever is less. Acceptable