7.5x5 Crack Package Issue 8D.ppt

7.5*5 Crack Package Issue 8D STS BGA 17-Nov-2009 17.4.9 Team Leaders: Yu OUYANG, Single BGA Manager Pengshu ZHOU, Single BGA Chief Engineer Team Members: Grangrui WANG, QA Engineer Fan LI, Process Engineer Hong SHAO, Process Engineer Chengdong LI, Process Engineer 7.5x5 Crack Package Issue 8D 2pcs serious broken W5FC units were detected and feedback from customer. This type of crack should be caused by strong mechanical stress introduced on trays which contain the affected units, shown in the picture right. Effective: Week47’2009 Responsible: Hong SHAO Chengdong LI Description: Immediately highlight the quality problem to all relevant QA Production people. Checked packing process in production line, no anomaly found. 17.4.9 There is risk of serious package crack problem due to strong mechanical stress related to handling and operation with binding machine. To reproduce this type of defect, we performed some trails at the most extreme situation: binding was continued when the units were splash inside the trays(trays location is apparent uneven). And result comes out without surprise: strong stress broken some units inside the trays. And extreme condition of handling was also simulated, which is involved in as a possible root cause. For this risk within ST Shenzhen, action was performed to have better control when focused on this problem, please see below 5D. For risk related to handling outside ST Shenzhen, we strongly recommend customer caring while unpacking to avoid any strong mechanical stress. 17.4.9 7.5x5 Crack Package Issue 8D Procedure flow char at R/L Plastic strip 17.4.9 7.5x5 Crack Package Issue 8D Thanks for everyone’s concern for this crack issue.