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Creep corrosion cracking
Corrosion Science 86 (2014) 142–148Contents lists available at ScienceDirect
Corrosion Science
journal homepage: www.elsevier .com/locate /corsc iCreep corrosion cracking of Sn–3.0Ag and Sn–0.5Cu solder
alloys in NaCl solution/10.1016/j.corsci.2014.05.004
0010-938X/ 2014 Elsevier Ltd. All rights reserved.
? Corresponding author. Tel.: +81 93 884 3356; fax: +81 93 884 3351.
E-mail address: yokken@post.matsc.kyutech.ac.jp (K. Yokoyama).Ken’ichi Yokoyama a,?, Akihide Nogami a, Jun’ichi Sakai b,c
aDepartment of Materials Science and Engineering, Kyushu Institute of Technology, 1-1 Sensui-cho, Tobata-ku, Kitakyushu 804-8550, Japan
b Faculty of Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan
cKagami Memorial Laboratory for Materials Science and Technology, Waseda University, 2-8-26, Nishiwaseda Shinjuku-ku, Tokyo 169-0051, Japan
a r t i c l e i n f oArticle history:
Received 24 December 2013
Accepted 5 May 2014
Available online 14 May 2014
Keywords:
A. Electronic materials
A. Tin
B. SEM
C. Intergranular corrosion
C. Stress corrosiona b s t r a c t
The surface crack nucleation of Sn–3.0Ag and Sn–0.5Cu solder alloys has been examined by performing
sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn–3.0Ag alloy, many
cracks nucleate and propagate on the side surface of the specimen, similarly to Sn–3.0Ag–0.5Cu alloy
reported previously. For Sn–0.5Cu alloy, such cracks are not observed, and ordinary creep deformation
occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smal-
ler for Sn–0.5Cu alloy than for Sn–3.0Ag alloy. The present results suggest that there are differences in the
susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free
solder alloys.
2014 Elsevier Ltd. All rights reserved.1. Introduction
Lead-free solders including Sn–Ag–Cu, Sn–Ag and Sn–Cu alloys
exhibit better corrosi
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