Numerical study of pin-fin heat sink with un-uniform fin height.pdf

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Numerical study of pin-fin heat sink with un-uniform fin height.pdf

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Numerical study of pin-fin heat sink with un-uniform fin height

Available online at /locate/ijhmt International Journal of Heat and Mass Transfer 51 (2008) 4788–4796Numerical study of pin-fin heat sink with un-uniform fin height design Yue-Tzu Yang *, Huan-Sen Peng Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan Received 27 August 2007; received in revised form 1 February 2008 Available online 8 April 2008Abstract This study presents the numerical simulation of the heat sink with an un-uniform fin height with a confined impingement cooling. The governing equations are discretized by using a control-volume-based finite-difference method with a power-law scheme on an orthogonal non-uniform staggered grid. The coupling of the velocity and the pressure terms of momentum equations are solved by the SIMPLEC algorithm. The well-known k–e two-equations turbulence model is employed to describe the turbulent structure and behavior. The parameters include the Reynolds number (Re = 15,000 and Re = 25,000) and 12 un-uniform fin height designs (Type-b to Type-m). The objective of this study is to examine the effects of the fin shape of the heat sink on the thermal performance. It is found that the junction temperature can be reduced by increasing the fin height near the center of the heat sink. The results also show that there is a potential for optimizing the un-uniform fin height design. 2008 Elsevier Ltd. All rights reserved. Keywords: Pin-fin heat sink; Un-uniform fin height; Electronics cooling; CFD1. Introduction Since the rapid development of electronic technology, electronic appliances and devices now are always in our daily life. Under the condition of multifunction, high clock speed, shrinking package size, and higher power dissipa- tions, the heat flux per unit area increased dramatically over the past few years. Besides, the working temperature of the electronic components may exceed the desired tem- perature level. Thus, the effective removal of heat dissipa- tions and maintaining the