The Influence of Standoff Height and Pad Size on the Shear Fracture Behavior of Cu-SAC305-Cu Joints.pdf
- 1、本文档共6页,可阅读全部内容。
- 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
The Influence of Standoff Height and Pad Size on the Shear Fracture Behavior of Cu-SAC305-Cu Joints
The Influence of Standoff Height and Pad Size on the Shear Fracture Behavior of BGA
Structured Cu/Sn3.0Ag0.5Cu/Cu Interconnects
LI Xun-Ping, XIA Jian-Min, ZHOU Min-Bo, MA Xiao, ZHANG Xin-Ping
School of Materials Science and Engineering, South China University of Technology,
Guangzhou 510640, China
Email: mexzhang@scut.edu.cn; Tel: +86-20
Abstract
The influence of the standoff height, pad size and
isothermal aging on the microstructure and shear fracture
behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured
interconnects were investigated using the lap-shear test. The
experimental results show that the thickness of intermetallic
compounds (IMC) layer at the solder/Cu interface increases
with decreasing standoff height of the joints. The size of
Kirkendall voids and the porosity increase inversely with the
standoff height upon isothermal aging treatment. Shear
strength of the joints depends strongly on both the solder
volume and pad size. Moreover, the isothermal aging
treatment doesn’t change the shear strength trend of the joints
with a pad diameter of 0.48 mm, while varying the shear
strength trend of the joints with a pad diameter of 0.32 mm.
The typical fracture location of the joints changes from the
position near interface gradually to the middle of the solder
matrix with decreasing the standoff height of the joints, while
being independent of aging time and pad size. In addition, it
has been shown that Kirkendall voids play an important role in
influencing the fracture mode of the solder joints with the
standoff height larger than 0.15 mm.
1. Introduction
The solder interconnect structures such as flip-chip ball
grid array (BGA) packages are mainly subjected to shear
stresses due to the mismatch of coefficients of thermal
expansion of the various materials in packaging system. As is
well-known, the solder ball shear test has been widely used to
assess the solder ball attachment strength in BGA packages.
However, in the
您可能关注的文档
- SolidWorks零件配置功能三大应用技巧.pdf
- Solving stochastic shortest-path problems with RTDP.pdf
- Somatostatin analogue in the localization and treatment of.pdf
- Some bialgebroids constructed by Kadison and Connes-Moscovici are isomorphic.pdf
- Song Post Height in Relation to Predator Diversity and Urbanization (pages 529–538).pdf
- Some Possibilities for Charm Studies at B-factories.pdf
- Sorption-studies-of-neutral-red-dye-onto-poly(acrylamide-co-maleic-acid)-kaolinite-.pdf
- Sound velocities and elastic constants of iron-bearing hydrous ringwoodite.pdf
- SOP(update1) 目录.doc
- Sources and migration path of chemical compositions in a karst groundwater systems.pdf
最近下载
- 北京银行:首次公开发行股票招股说明书.docx
- 南京市2025届高三年级学情调研(零模)语文试卷(含答案详解).docx
- 《学习任务群视域下开展小学语文多文本阅读的实践研究》课题研究方案.doc
- 商业物业管理要点.ppt
- AIGC基础与应用 课件全套 第1--8章 认识AIGC---AIGC的发展与展望.pptx
- 佛山海天调味食品股份有限公司限制性股票激励计划.PDF
- AutomotiveSPICE 详解培训课件.pptx
- 办公室安全检查表.xls VIP
- GB50595-2010:有色金属矿山节能设计规范.pdf VIP
- 安徽省蚌埠市蚌山区2022-2023学年九年级上学期第一次月考数学试题( 含答案解析 ).docx VIP
文档评论(0)