--anti-caf技术资料汇整.docVIP

CAF相關資料 一、文獻標準參考資料 : 文獻規範溫/濕度條件外加電歷時間 JIS-Z-3197Testing Method for Resin Type、Soldering、Flux40℃ 90~95%RHDC100V Off Line Test96 hrJIS-Z-3284Solder paste (Migration Test)40℃ 90~95%RH 85℃ 85~90%RHDC50V On Line Test1000 hrSolder paste (Insulation Resistance Test)40℃ 90~95%RH 85℃ 85~90%RHDC100V On Line Test168 hrIPC-TM-650 (2.6.3)Moisture and Surface、 Insulation Resistance、Fluxes85±2℃ 85%±2RHDC45~50V On Line Test96~168 hr35℃ 85~93%RHDC100V On Line Test96 hr50℃ 85~93%RHDC100V On Line Test168 hrMIL-F-14256Flux、Soldering、Resin Base85℃ 85%RHDC50V On Line Test96168 hrANSI-J-STD-004Requirements for Soldering 、Fluxes85℃ 85%RHDC50V On Line Test168 hr 二、國內外各廠商要求標準 : 廠商樣品規格測試條件絕緣組抗(Ω)文獻依據板厚 (mm)孔徑 (mm)孔距 (mm)台光電0.80.9 0.350.5 0.3DC50V/85℃/85%RH 96~168 hr1.0E+07IPC-TM-650台燿0.70.350.4 0.3DC50V/85℃/85%RH 1000 hr1.0E+07JIS-Z-3284SUMITOM (日)—0.40.5DC50V/60℃/90%RH 240-1000 hr1.0E+07JIS-Z-3284MEW (日)0.80.4—DC100V/110℃/85%RH 100 hr1.0E+07JIS-Z-3284台玻1.6、1.0 0.8、0.20.40.5DC50V/85℃/85%RH 1000 hr1.0E+07JIS-Z-3284SONY1.00.30.45 0.3DC50V/85℃/85%RH 240 hr1.0E+09MIL-F-14256HITACHI1.00.350.5DC100V/85℃/85%RH 1000 hr≧10E+08JIS-Z-3284TOSHIBA1.00.350.5DC100V/85℃/85%RH 1000 hr≧10E+08JIS-Z-3284鼎新1.00.30.45 0.3DC50V/85℃/85%RH 2 Cycle (JVC) 240 hr1.0E+07ANSI-STD-004三、測試Patter與Condition條件 : TUC Test 1Nan Ya Test1Japan PCB Test 1Japan PCB Test 2Japan PCB Test 3PatternHole diameter (mm)0.70.70.41.40.7TH-TH Diameter (mm)0.350.3、0.4 0.5、0.60.3、0.41.20.3、0.4 0.5、0.6Lays4 LaysDouble side8 LaysDouble sideDouble sideConditionTemperature85℃85℃85℃85℃121℃Humidity85%RH85%RH85%RH85%RH—Pressure————2 atmsApplied VoltageDC50VDC50VDC50VDC50V—Measure VoltageDC100VDC500VDC100VDC100VDC500VTest frequencyIn chamber and measurement IR every 240hrs (On-line)In chamber and take out measurement IR every 250hrs (Off-