IC封装产业介绍及常用封装方式简述(图文版)选编.ppt

现在的世界就是一颗一颗芯片芯片需要封装所以世界正在被一颗一颗的封装;封装在IC制造产业链中之位置;封装作业之一般流程(QFP为例);封装用原材料以及所需零组件;封装用机台以及所涉及模具;封装趋势演进图;封装类型分类;DIP封装之特点 1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。 2.芯片面积与封装面积之间的比值较大，故体积也较大。 DIP封装图示 body thickness：155mil PKG thickness: 350mil Lead width: 18.1mil Lead pitch: 100mil DIP系列封装其他形式 PDIP（Plastic DIP）、CDIP（Ceramic DIP） SPDIP（Shrink plastic DIP）;二、SOP/SOJ小尺寸封装;SOP (Small Out-Line Package)封装形态之图示body thickness:87~106mil PKG thickness:104~118mil Lead width: 16 milLead pitch: 50 mil SOJ ( Small Out-Line J-Lead package)封装形态之图示body thickness:100 mil PKG thickness:130~150mil Lead width: 17~20 mil Lead pitch: 50 mil;SOP封装系列之其他形式 1.SSOP(Shrink SOP) body thickness：70~90 mil PKG thickness: 80~110mil Lead width: 10~15 mil Lead pitch: 25 mil 2.TSOP(Thin SOP) body thickness：1.0 mm PKG thickness: 1.2mm Lead width: 0.38~0.52 mm Lead pitch: 0.5 mm;3.TSSOP(Thin Shrink SOP) body thickness：0.90 mm PKG thickness: 1.0mm Lead width:0.1~0.2mm Lead pitch: 0.4~0.65mm 4.TSOP(Ⅰ) : Thin SOP Ⅰ 5.TSOP(Ⅱ ) : Thin SOP Ⅱ 6.QSOP : Quarter Size Outline Package 7.QVSOP : Quarter Size Very Small Outline Package ;三、QFP方型扁平式封装和PFP扁平封装;QFP方型扁平式封装和PFP扁平封装图示 body thickness：2.8 mm PKG thickness: 3.3 mm Lead width: 0.18~0.35mm Lead pitch: 0.40~1.0 mm QFP封装系列之其他形式 1.LQFP(Low profile QFP)： body thickness：1.4mm PKG thickness: 1.6mm Lead width: 0.22~0.37mm Lead pitch: 0.40~0.80mm ;2.TQFP(Thin QFP): body thickness：1.0 mm PKG thickness: 1.2 mm Lead width: 0.18~0.37 mm Lead pitch: 0.40~0.80 mm 3.DPH-QFP(Die Pad Heat Sink QFP) body thickness：2.8 mm PKG thickness: 3.3 mm Lead width: 0.2~0.3 mm Lead pitch: 0.5 mm;4.DPH-LQFP(Die-pad Heat Sink Low-profile QFP) body thickness：1.4 mm PKG thickness: 1.6 mm Lead width: 0.22 mm Lead pitch: 0.5 mm 5.DHS-QFP(Dro