CNM烈度计开发.pptVIP

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CNM烈度计开发

Si sensor developments at CNM Manuel Lozano Radiation detector group Started in 1996 Main activities: Radiation detector development Radiation effects in materials, devices and circuits Packaging Medical imaging 11 people More researchers at CNM from other department joining radiation detector activities Circuit design Device development Simulation CNM Clean Room expansion From 1000 to 1500 m2 New are for nanotechnology New set of equipment relevant for advanced packaging Wafer grinder CMP Wafer alignment and bonding system IR transparent detectors Development of strip detectors transparent to IR for direct alignment In collaboration with IFCA New process run for material characterization already started Detectors manufactured this year 3D technology Due to the low field problem of Single Sided 3D detectors, CNM decided to develop a two-side 3D technology. In collaboration with Glasgow University that are doing the simulations New mask set designed Technology developed First wafers already finished, only N-type, good results. 2nd and 3rd process runs started, N-type and P-type Very interesting for LHC pixels, very high radiation hardness. Useful for LC? 3D technology Schematic technology cross section Medipix2 pixel configuration Holes filled with poly and doped SEM images of top part of holes ALIBAVA: A readout system for microstrip silicon sensors Joint development of Liverpool Univ., IFIC-Valencia and CNM-Barcelona Need of a simple and cheap system for detector charge collection performance characterization Difficulty for obtaining this type of measurements: Required equipment is expensive A large number of channels has to be monitored Many different approaches: NIM, CAMAC, VME or custom electronic module Testing with an electronic system as similar as possible to those used at LHC experiments: LHC front end readout chip should be used Analog readout is preferred for pulse shape reconstruction System characteristics The system is compact and portable. Two tr

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