(A)期刊论文_10589.doc

　五、論文著述： 請詳列個人最近五年內發表之學術性著作。 請將所有學術性著作分成四大類：(A)期刊論文(B)研討會論文(C)專書及專書論文(D)技術報告及其他等。 各類著作請按發表時間先後順序填寫。每篇文章請依作者姓名（按原出版之次序）、出版年、月份、題目、期刊名稱、起迄頁數之順序填寫。 若期刊屬於SCI、EI、SSCI或AHCI等時，請註明；若著作係經由國科會補助之研究計畫所產生，請於最後填入相關之國科會計畫編號。 論文著述(表C302)，請採MS Word 97(含)以上版本輸入資料，並將輸入的檔案以E-Mail 方式傳遞本會。E-Mail位址：nscapply@nsc.gov.tw，Mail之主旨請註明C302, “身份證號碼”; 。 (A).期刊論文 1. Chein, R., and Su, T.W., “Numerical Modeling of Particle Dynamics in a Cylindrical Chamber Containing a Heated Rotating Disk,” Aerosol Science and Technology, vol. 38, pp. 185-193, 2004. SCI (NSC-90-2212-E-005-020) 2. Chein, R., and Tsai, S. H., “Microfluidoic Flow Switching Design Using Volume of Fluid Model,” Biomedical Microdevices, vol. 6(1), pp. 81-90, 2004. 3. Tsai, T. H., Yang, H., and Chein, R., “New Electroforming Technology Pressure Aid for LIGA Process,” Microsystem Technology, pp. 351-356, 2004. SCI (NSC-90-2218-E-005-005) 4. Tsai, T. H., Yang, H., and Chein, R., “High-aspect ratio Microstructure Filling by Centrifugal Field Modeling,” Microsystem Technology, pp. 571-577, 2004. SCI (NSC-91-2218-E-005-001) 5. Chein, R. and Huang, G., “Thermoelectric Cooler Application in Electronic Cooling, Applied Thermal Engineering, pp. 2207-2217, 2004. SCI 6. Yang, H., Chein, R., Tsai , T. H., Chang , J. C. and Wu, J. C., “High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process,” in press, Miscrosystem Technology. 7. Chein, R. and Liao, W., “Analysis of Particle-Wall Interactions During Particle Free Fall,” Journal of lloid and Interface Science, Vol. 288, pp. 104-113, 2005. 8. Chein, R. and Chen, Y., “Performances of Thermoelectric Cooler Integrated with Microchannel Heat Sinks,” Intl J. of Refrigeration, Vol. 28, pp. 828-839, 2005. 9. Chein, R. Liao, W., “Thermophoretic Effects on Nanoparticle Deposition in a Heated Channel Flow,” Heat and Mass Transfer, Vol. 42, pp. 71-79, 2005. 10. Chein, R. and Huang, G., “Analysis of Microchannel Heat Sink Performance Using Nanofluids,” Applied Thermal En