多物理场PCB仿真-ApplicationBrief.PDF

Application Brief Multiphysics Simulation of a Printed Circuit Board When evaluating printed circuit board (PCB) designs, engineers must balance the require- ments of multiple physics disciplines in optimizing PCB reliability. RD teams must closely study three broad areas of product reliability — electrical, thermal and mechanical — to pro- duce PCB designs that contribute to long service life and reduced product failure. You can use ANSYS software in an integrated fashion to examine the overall reliability of a printed circuit board, simulating individual physical phenomena as well as the interaction between physics disciplines to improve overall product performance. Products ANSYS® SIwave™, ANSYS Icepak®, ANSYS Mechanical™ Keywords PCB design, DC IR drop, thermal dissipation, thermomechanical stress Description When designing a printed circuit board for reliability, there are three broad areas to consider: electrical, thermal and mechanical reliability. Evalua- tion of electrical reliability requires power- and signal-integrity analysis to minimize crosstalk and evaluate the board’s power integrity. Addressing