影响光纤衰减的痕量杂质.pdf

Pure Appl. Chern., Vol.54, No.4, pp.819—831+, 1982. 82/040819—16$03.OO/O Printed in Great Britain. Pergamon Press Ltd ©1982 IUPAC TRACE ANALYSIS AND ULTRAPURIFICATION OF MATERIALS FOR OPTICAL WAVEGUIDE TECHNOLOGY James W. Mitchell Bell Laboratories, Murray Hill, New Jersey 0797!t, USA Abstract — In the telecommunications industry techniques for purifying and characterizing materials, and analytical methods for solving chemical problems have been vitally important for technological progress. The application of reliable analytical methods to determine optimum conditions for pre— paring materials in controlled states of purity continues to be essential. In fact, the production of materials with unique properties, determined by doping precisely with impurities on the one hand or by insuring the absence of other detrimental ones, continues to be a key to technological advancement. The most recent critical need in the industry for pure materials and ultratrace analysis resulted from the initiation of applied research and development of optical wave— guide systems, where tolerance limits for waveguide materials were projected to be in the 2 to 100 ng/g range for commonly found transition metal impurities Fe, Co, Cr, Cu, Mn, Ni, and V. Applications of neutron activation, X—ray fluorescence, atomic absorption,and laser intracavity absorption spectro— scopy in support of optical waveguide programs will be discussed. Examples will be provided to demonstrate the use of these techniques for screening commercially available glass—mak