IGBT模块散热性能的仿真和实验研究.PDF

中国科技论文在线 # IGBT模块散热性能的仿真和实验研究 1 1 2 2 2** 张永智 ，余小玲 ，郑军 ，贺东晓 ，王晓宝 （1. 西安交通大学能源与动力工程学院，西安 710049 ； 2. 江苏宏微科技有限公司，江苏常州，213101 ） 摘要：IGBT 模块正在向小尺寸、大功率的方向发展，因此散热问题已成为制约IGBT 模块 可靠性的瓶颈。热仿真和热设计是IGBT 模块设计的一个重要环节。本文系统地对IGBT 模 块及其散热系统进行全面热仿真,并与实验数据进行对比。对 IGBT 模块的温度场分布，结 壳热阻的构成等进行分析。结果表明，所建模型能够准确计算模块的温度分布。在构成结壳 热阻的4 部分——芯片热阻、焊料热阻、覆铜陶瓷板热阻、铜基板热阻中，覆铜陶瓷板热阻 为主要部分，占整个结壳热阻的75% 以上。 关键词： IGBT 模块; 结壳热阻; 热仿真 中图分类号：TK124 Thermal Simulation and Experiment research on an IGBT module 1 1 2 2 2 ZHANG Yongzhi , YU Xiaoling , ZHENG Jun , HE Dongxiao , WANG Xiaobao (1. School of Energy and Power Engineering, Xian Jiaotong University, Xian 710049; 2. MacMic Science Technology Co. Ltd., Changzhou, Jiangsu 213101) Abstract: The power density of the IGBT (Insulated Gate Bipolar Transistors) module is skyrocketing, and the problem of heat transfer has become the bottleneck restricting its reliability. Thermal analysis plays an important role in the design of IGBT modules. A comprehensive thermal simulation was conducted on an IGBT module and its heat sink, and the simulation results were compared with the experimental data. The temperature distribution and the composition of the junction-to-case thermal resistance were analyzed. The results show that the thermal model established can calculate the temperature distribution of the IGBT module accurately. Among t