PCB专业英语培训.ppt

前言 What is PCB? Printed Circuit Board PCB Effect？ Conduct Electricity Transmission Signel Supported Fixation Action 一.Department Introduction 部門介紹 Incoming Quality Control IQC (来料检查) Incoming process Quality Control IPQC (生产过程品质控制) Final Quality Control FQC(最终品质管控) Quality Assurance QA (品质保证部 ) Marketing MKT(市场部 ) Production Material Control PMC(计划部 ) Manufacturing Engineering ME (制作工程部) Production PD (生产部 ) Administration MaintenanceAM (行政及維修部) Human ResourcesHR (人力資源部) Research DevelopmentR D (研究及發展部) Purchasing and ShippingP S (採購及船務部) AccountACC (財務部) Training DepartmentTR (培訓部) Management Information SystemMIS (資訊系統部) Process EngineerPE (工序工程部) FQC QA MKT PMC ME PD IQC IPQC AM HR R D P S ACC TR MIS ProcessEngineer PCB Process CodePCB工序代碼 Inner Dry Film 三、Defect Introduction 缺點介紹 1.Board Cut (界 料) Poor exposure Poor circuit Scratch circuit Under etching Over etching 2.Inner Layer(內層) Ink residue Spacing under size Insufficient linewidth Nick circuit 4.Drilling（鑽孔） Excess hole Hole shift Hole damage Drill burr Hole contamination Board dirty Rough hole Block hole Scratch Hole open Board damage Drop vat 6.Outer Layer（外層） Dry film residue Foreign matter under DF Film peel off Poor exposure Insufficient line width CCT open Spacing under size Nick CCT(concave) Poor CCT Scratch CCT Under etching Over etching 7.Wet Film（濕菲林） S\M under cure S\M Peel off Oxidation under S\M Foreign matter under W\F S\M shift S\M bleeding S\M in hole S\M skipping S\M bubble S\M bridge broken Poor S\M Poor carbon ink Excess S\M point rework 8. Legend Printing（白字） C\M unclear C\M shift C\M in hole Wrong\ missing mark Missing C\M Poor C\M C\M on wrong side C\M peel off 9. Surface Treatment(表面處理) Poor on G\F Organic Solderability Preservatives Pit on gold finger Nick on G\F Scratch on G\F Solder on G\F Copper expose on root of G\F S\M peel off on root of G\F G\F bevel edge deviation Insufficient gold thickness W\F on G\F Den