ARRAY工程简介.pptVIP

May 2003 PeakPerformanceT PCM ARRAY工程简介 目录 ARRAY制造流程图 TFT Array组成材料 TFT –GATE电极形成 TFT – Active(岛状半导体形成) TFT –S/D源漏电极形成 TFT –钝化层及接触孔形成 TFT – ITO像素电极形成 PVD简介 PECVD简介 WET简介--湿刻设备构成 WET简介—各工艺单元功能 WET简介—工程概念图 DRY简介 DRY简介 PHOTO-曝光显影蚀刻基本概念 PHOTO-显影 PHOTO-显影 TEST – AOI – Auto optical inspection configuration TEST – AOI – Auto optical inspection configuration TEST-O/S TEST TEST－ Array Test TEST-Array TEST TEST-TEG TESTER TEST-TEG Measurement Structure TEST- Array laser repair TEST- Array laser configuration TEST--CDC TEST--CDC CD Measurement Total Pitch Measurement Overlay Measurement SHANGHAI TIANMA MICRO-ELECTRONICS CO.,LTD. * Shanghai Tianma Micro electronics Co.,Ltd * NPI 段晓海 ARRAY制造流程图 PVD简介 CVD工程 WET工程 DRY工程 PHOTO工程 TSET简介 物理气相沉积PVD(Physical Vapor Deposition) 阴极 靶材 阳极 腔体 泵 基板 电浆辅助化学气相沉积 Plasma Enhanced Chemical Vapor Deposition IN CV EUV N CV ETCH ZONE DI RINSE UNIT A/K dry2 dry1 液刀 风帘 干燥风刀 置换液刀 Out CV 设备主要工艺单元： EUV unit:祛除玻璃表面有机残留物。 Etch zone:刻蚀区域 Rinse unit:水洗单元 Dry unit：干燥单元 液刀：主要起预湿（置换），冲刷的效果。 风帘：主要是吹掉玻璃上残余的药液 风刀：干燥的玻璃的效果。 光阻剥膜 图形处理单元　 ←　2160mm　→ ←　　2400mm　　→ 3GB×44unit=132GB The CCD sensor detect the substrate, Image by the process unit. Defect can be reviewed precisely O/S test design Panel structure for O/S Test Every data line extands out of the active area connect with O/S pad On the other side all data line connected together by Shorting bar Array Tester ? Test station ? Electrical cabinet ? Operator console ? Environmental Enclosure Array tester Array tester Using instructions in the selected processing recipe, the pattern generator sends test signals to the probe frame. The illuminator is turned on, a bias voltage applied to the modulator and an image captured by the CCD camera. The image is sent to the image processing computer (IPPC) and panel flaws are identified and stored in the defect file by the Sun host computer. Array tester optical part Light from the illuminator is reflected by the modulator and the image captured on the CCD