arlon材料.pdf

65GT, 55ST, 55NT and 55RT Arlon Epoxy Nonwoven Aramid Products Electronic Substrates Arlon 65GT, 55ST, 55NT and 55RT laminate and prepreg systems are based on DuPonts Thermount®, a nonwoven aramid (NWA) reinforcement, and are engineered to provide a unique combination of properties to the designer of HDI and SMT printed circuit boards. Arlons epoxy NWA products are ideal for such diverse applications as MCM-L, Fine Pitch SMT, BGA and Micro-BGA, and LCCC and offer design and performance advantages in a wide range of end uses such as handheld phone boards and burn-in boards for IC testing. Arlon 65GT Halogen-Free “Green” UL-94 V0 NWA-Epoxy System is Environmentally Friendly for Conscientious Consumers Arlon 55ST IPN (Interpenetrating Polymer Network) Resin Technology Delivers High Peel Values and Internal Cohesive Strength For Enhanced Reliability and Resistance to Mechanical Shock Arlon 55NT Lowest X-Y CTE Values for Surface Mount Technology Arlon 55RT Multifunctional Epoxy Resin on NWA Substrate Features Benefits • 100% Organic Random • Laser Microvias as small as 25-50 microns Fiber Reinforcement Resists Resin Microcracking in Handheld PCDs • Outstanding CAF Resistance • Reduced Risk of Electrical Failure in Service • Minimal Etch Shrinkage • Excellent layer to layer registration • Smooth Surface • Ultrafine line definition with thin copper foil • High Tg Resin Systems • Improved PTH Reliability • Low In-Plane CTE • Improved Reliability through Thermal Cycling of Numerous SMT Package Configurations • UL Flammability Rating