IGBT失效分析IGBTFailureAnalysis李旭LiXu(Leo)IFBJIMMQM.ppt

失效分析 Introduction 失效分析的目的是为了维护良好的客户关系，改进产品质量，提高竞争力Failure Analysis is to support customers more effectively during problem solving, and to feedback from field/application for Infineon’s further product development, yield enhancements 失效分析的分析内容是寻找故障点的位置，表征故障现象，确定导致故障的根本原因 Failure Analysis is the localization and characterization of defects 失效分析需要采取多种分析手段，直到找到故障的根本原因，或者直到穷尽所能采取的分析手段 It is necessary to continue until you find the cause or exhaust all tests doing so. 失效分析的挑战：分析周期，分析成本与准确性之间的平衡 Challenge: Do it as fast and accurately as possible 失效分析的分析方法与分析流程FAILURE ANALYSIS-Step By Step For IGBT Item 分析方法与分析流程 注解Remarks 1 分析客户反馈的信息 Customer Information 2 外观检查 Visual Inspection 无损检测 Nondestructive 3 电性能分析 ELECTRICAL VERIFICATION 无损检测 Nondestructive 4 X射线检测 X-ray Inspection 无损检测 Nondestructive 5 超声波显微镜检测 Ultrasonic Microscope 无损检测 Nondestructive 6 去除塑料外壳 Opening Housing/Lid Removal 破坏性检测 Destructive 7 去除硅胶，去除绝缘钝化层 Gel Removal and Polyimide Removal 破坏性检测 Destructive 8 光学显微镜检测 Optical Microscope 无损检测 Nondestructive 9 液晶热点成像分析 FAULT ISOLATION by Liquid Crystal Analysis 10 高端仪器深入分析 Advanced FAULT ISOLATION – Delayering, Photon Emission Microscope, SEM, Cross-section, FIB 破坏性检测 Destructive 11 分析、总结失效机理 ，确定失效的根本原因 FAILURE MECHANISMS- SUMMARY and REVIEW 失效分析的分析方法与分析流程FAILURE ANALYSIS-Step By Step For IGBT 1.分析客户反馈的信息 Customer Information 反馈信息表 FAR Form IGBT应用的条件 客户观测的故障信息 是否已知故障 失效分析的分析方法与分析流程FAILURE ANALYSIS-Step By Step For IGBT 2.外观检查 Visual Inspection 是否有导热硅脂残留？ Thermal grease found? 是否已安装PCB板？ PCB mounted? 塑料外壳是否被破坏？ Housing damaged? 是否有烟雾残留物？ Smoke residues found? 基板是否已被破坏？Base plate damaged? 模块是否爆炸？ Module exploded? 模块是否被打开？ Module already opened? 管脚是否有焊锡残留，是否弯曲，是否脱落？ Solder at pins? Bent pins? Missing pins? 失效分析的分析方法与分析流程FAILURE ANALYSIS-Step By Step For IGBT 3.电性能分析 ELECTRICAL VERIFICATION 可编程特性曲线测量 Programmable Curve Tracer 高压直流电源 High Voltage DC Supply 失效分析的分析方法与分析流程FAILURE ANALYSIS-Step By Step For IGBT