【2017年整理】IPC-6013-chinese2.ppt

IPC-6013;Scope 适应范围; Class 1 - General Electronic Products 第一级-普通电子产品 Includes consumer products, some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed electronics assembly. 包括这些产品：计算机和计算机表面次要的配套产品，主要是符合电子组装的功能。 Class 2 – Dedicated Service Electronic Products 第二级-精密的电子产品 Includes communications equipment, sophisticated business machines, and instruments where high performance and extended life is required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed. 包括通讯设备，精密的商业机器，这些设备要求寿命长，并且操作中不能中断，但是这些要求不是很严格的，也可以允许有一些较小的缺陷出现。 ; ;3.0 Requirements 要求;3.3 Visual Examination目检;3.3 Visual Examination目检;3.3 Visual Examination 目检;Defect: Projection and Island 缺陷：板面突出物和孤岛 Shall not reduce conductor spacing by more than 30%. 不能减少电路间距的30%以上 Example: Conductor spacing = 10 mils 例如：电路间间距=10mils Conductor spacing 70% of 10 mils 电路间间距10mils的70% Conductor spacing 7 mils 电路间间距7mils ;Foreign Inclusion Translucent particles trapped within the board shall be acceptable. 板内夹杂的物体是透明的，可以接受。 ;3.3.2.10 Covercoat Requirement (Solder mask or Coverlay)对表面覆盖物的要求（阻焊剂或覆盖膜）;3.3.2.10.1.f BGA Land MisregistrationBGA对位偏移;3.3.2.11 Solder Wicking/ Plating penetration 焊锡渗入/镀液渗入;3.3.2.12 Stiffener (Mechanical support) 补强板（机械支撑）;Annular Ring Breakout Defects 孔环破孔缺陷;3.5.3.6 Final Finish Coverage 最终处理膜之覆盖性;3.5.3.3 Edge Conductor Lands 板边连接地 ;3.5.3.3 Edge Conductor Lands 板边连接地;3.5.3.4 Dewetting缩锡;3.5.3.5 Nonwetting拒锡